Abstract
Absorption mechanism of epoxy resin 618/4,4'-diaminodiphenylsulfone(DDS)matrices has been studied through thermogravimetry analysis(TGA), dynamic mechanical analysis (DMA), positron annihilation technique (PAL) and dielectric properties. It is found that the moisture absorption rate of epoxy resin is 3.5%. The thermal weight loss temperature doesn't change after absorbing water. Owing epoxy resin absorbs moisture, storage modulus decreases about 250 MPa and glass temperature decreases up to 50°C. And there are two peaks at loss modulus curve after epoxy resin moisture absorption. Dielectric constant and dielectric loss increase after moisture absorption. The water molecules penetrate the resin as plasticizer agent with free volume size decreasing and concentration increasing, resulting in more cracks in the epoxy resin matrix.
| Original language | English |
|---|---|
| Pages (from-to) | 110-113 |
| Number of pages | 4 |
| Journal | Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering |
| Volume | 25 |
| Issue number | 8 |
| State | Published - Aug 2009 |
Keywords
- Epoxy resin
- Free volume
- Moisture absorption mechanism
- Positron annihilation