Microstructure evolution and mechanical property of quaternary Cu-7%Al-4%Ni-2.5%Mn alloy solidified within ultrasonic field

X. Wang, Y. J. Hu, J. Y. Wang, W. Zhai, B. Wei

Research output: Contribution to journal › Article › peer-review

16 Scopus citations

Fingerprint

Dive into the research topics of 'Microstructure evolution and mechanical property of quaternary Cu-7%Al-4%Ni-2.5%Mn alloy solidified within ultrasonic field'. Together they form a unique fingerprint.

Engineering

Physics

Material Science