@inproceedings{849f895e8c62471d8dbc47b4e90a1f68,
title = "Micromechanical modeling of the cyclic behavior of Sn-0.7Cu solder based on micromechanical polycrystalline approach",
abstract = "In the current research, a small strain multi-scale constitutive model based on self-consistent method is developed to describe the rate- and temperature-dependent behavior of cyclic deformed Sn-0.7Cu solder. A modification is proposed on the traditional elastic plastic self-consistent (EPSC) model to capture the elasto-viscoplastic behavior of Sn-0.7Cu solder. A modified Voce hardening law is proposed to describe the decrease of hardening rate with the increase of the accumulated shear strain. The developed model is compiled into finite element analysis to predict the macroscopic behavior of polycrystalline materials. The prediction is verified with the Taylor factor and the experimental data of Sn-0.7Cu solder. The reasonable accurate prediction shows that the model is effective in simulating the cyclic behavior of Sn-0.7Cu solder at different temperatures and strain rates.",
keywords = "cyclic behavior, elastic plastic self-consistent model, micromechanics, polycrystalline, rate-dependent",
author = "Lu Liu and Yao Yao",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 18th International Conference on Electronic Packaging Technology, ICEPT 2017 ; Conference date: 16-08-2017 Through 19-08-2017",
year = "2017",
month = sep,
day = "19",
doi = "10.1109/ICEPT.2017.8046437",
language = "英语",
series = "18th International Conference on Electronic Packaging Technology, ICEPT 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "197--202",
editor = "Chenxi Wang and Yanhong Tian and Tianchun Ye",
booktitle = "18th International Conference on Electronic Packaging Technology, ICEPT 2017",
}