Investigation on the microstructure, mechanical and electrical properties of Ti3SiC2/Cu joint obtained by Ti25Zr25Ni25Cu25 amorphous high entropy alloy and Ag composite filler

Xin Nai, Haiyan Chen, Shuai Zhao, Xiangwei Kong, Qian Wang, Pengcheng Wang, Wenya Li

Research output: Contribution to journalArticlepeer-review

20 Scopus citations

Fingerprint

Dive into the research topics of 'Investigation on the microstructure, mechanical and electrical properties of Ti3SiC2/Cu joint obtained by Ti25Zr25Ni25Cu25 amorphous high entropy alloy and Ag composite filler'. Together they form a unique fingerprint.

Material Science