Interface morphology and microstructure evolution of Cu-0.5Cr alloy in directional solidification

Xiaoli Li, Jinshan Li, Rui Hu, Hongchao Kou, Ling Tang, Hengzhi Fu

Research output: Contribution to journalArticlepeer-review

Abstract

Effects of directional growth rate on solidification structure of Cu-0.5Cr alloy have been described in directional solidification. It is found that the solidification structure of the alloy is evolved from planar to cellular to coarse dendrite to hexagon cellular, and then to fine plate-like structure with varying solidified growth rate from 2 μm/s to 500 μm/s in the condition of 200 K/cm temperature gradient. The presence of eutectic phase from non-equilibrium solidification can be observed in directional solidification structure of the alloy with the solidification rate more than 10μm/s, whose volume fraction is reduced with the increase of the solidification rate. The value of primary dendritic arm spacing in Cu-0.5Cr alloy is located between the calculated results of the KF model and the Hunt-Lu model.

Original languageEnglish
Pages (from-to)666-669
Number of pages4
JournalTezhong Zhuzao Ji Youse Hejin/Special Casting and Nonferrous Alloys
Volume27
Issue number9
StatePublished - Sep 2007

Keywords

  • Cu-Cr Alloy
  • Directional Solidification
  • Microstructure

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