Influence of thermal shock and environment temperature on mechanical properties of C/SiC/GH783 joint brazed with Cu-Ti + Mo

Juanli Deng, Bohan Zheng, Shangwu Fan, Xing Wang, Litong Zhang, Laifei Cheng

Research output: Contribution to journalArticlepeer-review

8 Scopus citations

Fingerprint

Dive into the research topics of 'Influence of thermal shock and environment temperature on mechanical properties of C/SiC/GH783 joint brazed with Cu-Ti + Mo'. Together they form a unique fingerprint.

Material Science