Abstract
The effect of bonding time on the void evolution and shear strength of press bonding interface was investigated in the press bonding of TC4 alloy under a high bonding pressure of 30 MPa by experimental methods. The results indicate that the macroscopic plastic deformation of TC4 alloy is observed because of the high bonding pressure. With the prolonging of the bonding time, the deformation degree of TC4 alloy increases, which promotes the void closure by decreasing the void size and increases the bonding ratio. As the bonding time is 30 min, the bonding ratio is up to 96.2%. As the bonding time prolongs from 5 min to 10 min, the shear strength of bond increases; continuing to prolong the bonding time, the shear strength of the bond slowly decreases because of the microstructure coarsening of the bond.
| Original language | English |
|---|---|
| Pages (from-to) | 179-182 |
| Number of pages | 4 |
| Journal | Suxing Gongcheng Xuebao/Journal of Plasticity Engineering |
| Volume | 23 |
| Issue number | 6 |
| DOIs | |
| State | Published - 28 Dec 2016 |
Keywords
- Bonding ratio
- Press bonding
- Shear strength
- TC4 alloy
- Void evolution