High-Precision Probabilistic Imaging for Interface Debonding Monitoring Based on Electromechanical Impedance

Fei Du, Guanghao Wang, Jiexin Weng, Haodong Fan, Chao Xu

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Fingerprint

Dive into the research topics of 'High-Precision Probabilistic Imaging for Interface Debonding Monitoring Based on Electromechanical Impedance'. Together they form a unique fingerprint.

Engineering

Material Science