Abstract
A multilayer-structured polyimide nanocomposite based on a combination of polydopamine (PDA)-coated copper nanoparticles (CuNPs@PDA) and copper nanowires (CuNWs@PDA) was synthesized using a flexible and rapid method. The maximum thermal conductivity of (CuNPs-CuNWs)@PDA/polyimide (PI) composite with 10 wt% filler loading was increased to 4.13 W/mK, which was an enhancement by nearly 23 times compared with the use of neat PI matrix. The relative permittivity and dielectric loss were about 4.58 and 0.022 at 1 MHz, respectively. The use of multilayer-structure facilitated increased thermal conductivity and reduced permittivity of the nanocomposite compared with CuNPs@PDA/PI and CuNWs@PDA/PI films. The highly thermal conductive nanocomposites are promising for applications in thermal management.
Original language | English |
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Pages (from-to) | 19-21 |
Number of pages | 3 |
Journal | Materials Letters |
Volume | 237 |
DOIs | |
State | Published - 15 Feb 2019 |
Keywords
- Coating
- Electrical properties
- Polymer matrix composite
- Thermal properties