High-κ Polyimide-Based Dielectrics by Introducing a Functionalized Metal-Organic Framework

Qiang Guo; Zhiqiang Wu; Huihui He; Huihui Zhou; Yang Liu; Yanhui Chen; Zhenguo Liu; Lei Gong; Liangliang Zhang; Qiuyu Zhang

doi:10.1021/acs.inorgchem.1c03247

High-κ Polyimide-Based Dielectrics by Introducing a Functionalized Metal-Organic Framework

Qiang Guo, Zhiqiang Wu, Huihui He, Huihui Zhou, Yang Liu, Yanhui Chen, Zhenguo Liu, Lei Gong, Liangliang Zhang, Qiuyu Zhang

School of Chemistry and Chemical Engineering

Research output: Contribution to journal › Article › peer-review

12 Scopus citations

Abstract

In this work, novel metal-organic framework/polyimide (MOF/PI) composite films possessing dielectric properties were synthesized via a solution blending method. UiO-66 and UiO-66-NH₂ nanoparticles were first prepared by a hydrothermal method and added into PI to obtain the composite films. Compared with pure PI, the dielectric properties of the MOF/PI composites were substantially enhanced. The amine functionalization gave UiO-66-NH₂/PI composite films better dielectric properties in comparison with UiO-66/PI composite films because of improved interaction between PI and UiO-66-NH₂. It showed that the dielectric constant of the PI composite film containing 20 wt% UiO-66-NH₂ is 8.8 at 10² Hz, which was approximately 2.5 times that of the pure PI (3.5 at 10² Hz). The dielectric loss of the composite film was less than 0.034. Moreover, the breakdown strength of 20 wt% UiO-66-NH₂/PI composite films was found to be 208 kV/mm. We describe this new perspective for the preparation of high-performance polymer-based dielectric materials and their application as electrical materials.

Original language	English
Pages (from-to)	3412-3419
Number of pages	8
Journal	Inorganic Chemistry
Volume	61
Issue number	8
DOIs	https://doi.org/10.1021/acs.inorgchem.1c03247
State	Published - 28 Feb 2022

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title = "High-κ Polyimide-Based Dielectrics by Introducing a Functionalized Metal-Organic Framework",

abstract = "In this work, novel metal-organic framework/polyimide (MOF/PI) composite films possessing dielectric properties were synthesized via a solution blending method. UiO-66 and UiO-66-NH2 nanoparticles were first prepared by a hydrothermal method and added into PI to obtain the composite films. Compared with pure PI, the dielectric properties of the MOF/PI composites were substantially enhanced. The amine functionalization gave UiO-66-NH2/PI composite films better dielectric properties in comparison with UiO-66/PI composite films because of improved interaction between PI and UiO-66-NH2. It showed that the dielectric constant of the PI composite film containing 20 wt% UiO-66-NH2 is 8.8 at 102 Hz, which was approximately 2.5 times that of the pure PI (3.5 at 102 Hz). The dielectric loss of the composite film was less than 0.034. Moreover, the breakdown strength of 20 wt% UiO-66-NH2/PI composite films was found to be 208 kV/mm. We describe this new perspective for the preparation of high-performance polymer-based dielectric materials and their application as electrical materials.",

author = "Qiang Guo and Zhiqiang Wu and Huihui He and Huihui Zhou and Yang Liu and Yanhui Chen and Zhenguo Liu and Lei Gong and Liangliang Zhang and Qiuyu Zhang",

note = "Publisher Copyright: {\textcopyright} 2022 American Chemical Society",

year = "2022",

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doi = "10.1021/acs.inorgchem.1c03247",

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T1 - High-κ Polyimide-Based Dielectrics by Introducing a Functionalized Metal-Organic Framework

AU - Guo, Qiang

AU - Wu, Zhiqiang

AU - He, Huihui

AU - Zhou, Huihui

AU - Liu, Yang

AU - Chen, Yanhui

AU - Liu, Zhenguo

AU - Gong, Lei

AU - Zhang, Liangliang

AU - Zhang, Qiuyu

PY - 2022/2/28

Y1 - 2022/2/28

N2 - In this work, novel metal-organic framework/polyimide (MOF/PI) composite films possessing dielectric properties were synthesized via a solution blending method. UiO-66 and UiO-66-NH2 nanoparticles were first prepared by a hydrothermal method and added into PI to obtain the composite films. Compared with pure PI, the dielectric properties of the MOF/PI composites were substantially enhanced. The amine functionalization gave UiO-66-NH2/PI composite films better dielectric properties in comparison with UiO-66/PI composite films because of improved interaction between PI and UiO-66-NH2. It showed that the dielectric constant of the PI composite film containing 20 wt% UiO-66-NH2 is 8.8 at 102 Hz, which was approximately 2.5 times that of the pure PI (3.5 at 102 Hz). The dielectric loss of the composite film was less than 0.034. Moreover, the breakdown strength of 20 wt% UiO-66-NH2/PI composite films was found to be 208 kV/mm. We describe this new perspective for the preparation of high-performance polymer-based dielectric materials and their application as electrical materials.

AB - In this work, novel metal-organic framework/polyimide (MOF/PI) composite films possessing dielectric properties were synthesized via a solution blending method. UiO-66 and UiO-66-NH2 nanoparticles were first prepared by a hydrothermal method and added into PI to obtain the composite films. Compared with pure PI, the dielectric properties of the MOF/PI composites were substantially enhanced. The amine functionalization gave UiO-66-NH2/PI composite films better dielectric properties in comparison with UiO-66/PI composite films because of improved interaction between PI and UiO-66-NH2. It showed that the dielectric constant of the PI composite film containing 20 wt% UiO-66-NH2 is 8.8 at 102 Hz, which was approximately 2.5 times that of the pure PI (3.5 at 102 Hz). The dielectric loss of the composite film was less than 0.034. Moreover, the breakdown strength of 20 wt% UiO-66-NH2/PI composite films was found to be 208 kV/mm. We describe this new perspective for the preparation of high-performance polymer-based dielectric materials and their application as electrical materials.

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U2 - 10.1021/acs.inorgchem.1c03247

DO - 10.1021/acs.inorgchem.1c03247

M3 - 文章

C2 - 35171582

AN - SCOPUS:85125411595

SN - 0020-1669

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SP - 3412

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JO - Inorganic Chemistry

JF - Inorganic Chemistry

IS - 8

ER -

High-κ Polyimide-Based Dielectrics by Introducing a Functionalized Metal-Organic Framework

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