Fabricate of high-strength and high-conductivity Cu-Cr-Si alloys through ECAP-Bc and aging heat treatment

Tingbiao Guo; Junjie Wang; Yibo Wu; Xiaoyang Tai; Zhi Jia; Yutian Ding

doi:10.3390/ma13071603

Fabricate of high-strength and high-conductivity Cu-Cr-Si alloys through ECAP-Bc and aging heat treatment

Tingbiao Guo, Junjie Wang, Yibo Wu, Xiaoyang Tai, Zhi Jia, Yutian Ding

Lanzhou University of Technology

Research output: Contribution to journal › Article › peer-review

11 Scopus citations

Abstract

The effect of equal channel angular pressing (ECAP) through the route Bc and aging treatment on the grain structure and properties of the Cu-1Cr-0.2Si alloy was investigated. Microstructure was detected by scanning electron microscopy (SEM), x-ray diffraction (XRD), and electron backscatter diffraction (EBSD) and the mechanical properties and electrical conductivity were tested. Results shown that after ECAP, accompanying the grains refined to nano-and submicron-structure, the Cr particles were gradually spread along the grain boundaries (GBs), aging treatment promoted Cr particles dispersed in the matrix. ECAP greatly increased the ultimate tensile strength (UTS) while having a small effect on the conductivity, and aging treatment increased electrical conductivity. The stable 111<110> texture after ECAP and the lower dislocation density after aging treatment maybe the main reasons for the high conductivity of the material.

Original language	English
Article number	1603
Journal	Materials
Volume	13
Issue number	7
DOIs	https://doi.org/10.3390/ma13071603
State	Published - 1 Apr 2020
Externally published	Yes

Keywords

Cu-1Cr-0.2Si alloy
Electrical conductivity
Electron back-scattered diffraction (EBSD)
Equal channel angular pressing (ECAP)
Mechanical properties
Texture

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10.3390/ma13071603

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title = "Fabricate of high-strength and high-conductivity Cu-Cr-Si alloys through ECAP-Bc and aging heat treatment",

abstract = "The effect of equal channel angular pressing (ECAP) through the route Bc and aging treatment on the grain structure and properties of the Cu-1Cr-0.2Si alloy was investigated. Microstructure was detected by scanning electron microscopy (SEM), x-ray diffraction (XRD), and electron backscatter diffraction (EBSD) and the mechanical properties and electrical conductivity were tested. Results shown that after ECAP, accompanying the grains refined to nano-and submicron-structure, the Cr particles were gradually spread along the grain boundaries (GBs), aging treatment promoted Cr particles dispersed in the matrix. ECAP greatly increased the ultimate tensile strength (UTS) while having a small effect on the conductivity, and aging treatment increased electrical conductivity. The stable 111<110> texture after ECAP and the lower dislocation density after aging treatment maybe the main reasons for the high conductivity of the material.",

keywords = "Cu-1Cr-0.2Si alloy, Electrical conductivity, Electron back-scattered diffraction (EBSD), Equal channel angular pressing (ECAP), Mechanical properties, Texture",

author = "Tingbiao Guo and Junjie Wang and Yibo Wu and Xiaoyang Tai and Zhi Jia and Yutian Ding",

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doi = "10.3390/ma13071603",

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volume = "13",

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T1 - Fabricate of high-strength and high-conductivity Cu-Cr-Si alloys through ECAP-Bc and aging heat treatment

AU - Guo, Tingbiao

AU - Wang, Junjie

AU - Wu, Yibo

AU - Tai, Xiaoyang

AU - Jia, Zhi

AU - Ding, Yutian

PY - 2020/4/1

Y1 - 2020/4/1

N2 - The effect of equal channel angular pressing (ECAP) through the route Bc and aging treatment on the grain structure and properties of the Cu-1Cr-0.2Si alloy was investigated. Microstructure was detected by scanning electron microscopy (SEM), x-ray diffraction (XRD), and electron backscatter diffraction (EBSD) and the mechanical properties and electrical conductivity were tested. Results shown that after ECAP, accompanying the grains refined to nano-and submicron-structure, the Cr particles were gradually spread along the grain boundaries (GBs), aging treatment promoted Cr particles dispersed in the matrix. ECAP greatly increased the ultimate tensile strength (UTS) while having a small effect on the conductivity, and aging treatment increased electrical conductivity. The stable 111<110> texture after ECAP and the lower dislocation density after aging treatment maybe the main reasons for the high conductivity of the material.

AB - The effect of equal channel angular pressing (ECAP) through the route Bc and aging treatment on the grain structure and properties of the Cu-1Cr-0.2Si alloy was investigated. Microstructure was detected by scanning electron microscopy (SEM), x-ray diffraction (XRD), and electron backscatter diffraction (EBSD) and the mechanical properties and electrical conductivity were tested. Results shown that after ECAP, accompanying the grains refined to nano-and submicron-structure, the Cr particles were gradually spread along the grain boundaries (GBs), aging treatment promoted Cr particles dispersed in the matrix. ECAP greatly increased the ultimate tensile strength (UTS) while having a small effect on the conductivity, and aging treatment increased electrical conductivity. The stable 111<110> texture after ECAP and the lower dislocation density after aging treatment maybe the main reasons for the high conductivity of the material.

KW - Cu-1Cr-0.2Si alloy

KW - Electrical conductivity

KW - Electron back-scattered diffraction (EBSD)

KW - Equal channel angular pressing (ECAP)

KW - Mechanical properties

KW - Texture

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U2 - 10.3390/ma13071603

DO - 10.3390/ma13071603

M3 - 文章

AN - SCOPUS:85082952939

SN - 1996-1944

VL - 13

JO - Materials

JF - Materials

IS - 7

M1 - 1603

ER -

Fabricate of high-strength and high-conductivity Cu-Cr-Si alloys through ECAP-Bc and aging heat treatment

Abstract

Keywords

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