Experimental study of mechanical, electrical and thermal properties for 3d-printed copper nano-particles/pla matrix polymer composite

J. Saroia, Y. Wang, M. J. Lei

Research output: Contribution to journal › Conference article › peer-review

1 Scopus citations

Fingerprint

Dive into the research topics of 'Experimental study of mechanical, electrical and thermal properties for 3d-printed copper nano-particles/pla matrix polymer composite'. Together they form a unique fingerprint.

Material Science