Entropy engineering enabled atomically dispersed Cu doping leading to an exceptionally high thermoelectric figure of merit in n-type lead chalcogenides

Ziling Yuan, Mengyue Wu, Shuai Han, Pengfei Liu, Zhenhua Ge, Bangzhi Ge, Menghua Zhu, Yadong Xu, Wanqi Jie, Dongyao Zhao, Bingchao Yang, Yongsheng Zhang, Ming Liu, Min Zhu, Chao Li, Yuan Yu, Chongjian Zhou

Research output: Contribution to journal › Article › peer-review

16 Scopus citations

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Material Science

Engineering