Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper Under Torsional Deformation

C. P. Wang, J. K. Fan, F. G. Li, J. C. Liu

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Fingerprint

Dive into the research topics of 'Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper Under Torsional Deformation'. Together they form a unique fingerprint.

Engineering

Material Science