TY - GEN
T1 - Effect of space environment on the reliability of sintered silver nanoparticles reinforced by SiC particles
AU - Wu, Yanpei
AU - Feng, Xiaojing
AU - Xia, Weijuan
AU - Zou, Cheng
AU - Lu, Xiuzhen
AU - Liu, Johan
AU - Long, Xu
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/8
Y1 - 2019/8
N2 - Sintered silver nanoparticles(AgNPs) reinforced by SiC particles is a new alternative interconnection material for electronic packaging due to the advantage of its characteristics of high thermal conductivity, low sintering temperature and high working temperature. In space environment, AgNPs is subjected to the temperature alternating, irradiation and mechanical shock. In this paper, space service reliability is investigated based on shear strength and micromorphology. The results demonstrated that the long-term temperature alternating leaded to the decrease of reliability of AgNPs. However, irradiation had no influence on AgNPs. Meanwhile, mechanical shock didn't reduce the reliability of AgNPs. This paper investigate the influence mechanism and rules of reliability of AgNPs reinforced by SiC in space environment, which will further guide the performance design and optimization of AgNPs.
AB - Sintered silver nanoparticles(AgNPs) reinforced by SiC particles is a new alternative interconnection material for electronic packaging due to the advantage of its characteristics of high thermal conductivity, low sintering temperature and high working temperature. In space environment, AgNPs is subjected to the temperature alternating, irradiation and mechanical shock. In this paper, space service reliability is investigated based on shear strength and micromorphology. The results demonstrated that the long-term temperature alternating leaded to the decrease of reliability of AgNPs. However, irradiation had no influence on AgNPs. Meanwhile, mechanical shock didn't reduce the reliability of AgNPs. This paper investigate the influence mechanism and rules of reliability of AgNPs reinforced by SiC in space environment, which will further guide the performance design and optimization of AgNPs.
KW - Reliability
KW - SiC particles
KW - Sintered silver nanoparticles
KW - Space environment
UR - http://www.scopus.com/inward/record.url?scp=85084956140&partnerID=8YFLogxK
U2 - 10.1109/ICEPT47577.2019.245809
DO - 10.1109/ICEPT47577.2019.245809
M3 - 会议稿件
AN - SCOPUS:85084956140
T3 - 2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019
BT - 2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International Conference on Electronic Packaging Technology, ICEPT 2019
Y2 - 12 August 2019 through 15 August 2019
ER -