Diffusion bonding of Fe-based amorphous ribbon to crystalline Cu

F. T. Dong, X. Y. Xue, H. C. Kou, J. Wang, C. X. Niu, J. S. Li

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

A copper rod/FeSiB amorphous ribbon/copper rod sandwich laminated composite material has been successfully fabricated by co-pressing at temperatures within supercooled liquid region. The bonding interface has been characterized by scanning electron microscopy (SEM) and high resolution transmission electron microscopy (HRTEM). Results showed that a good bonding interface could be obtained only when the initial surface were carefully polished. The diffusion zone confirmed by EDS is about 60nm, indicating the bonding is in atomic metallurgical level via limited diffusion. The present results show that even the diffusion length is very small, diffusion bonding in the supercooled liquid region could be an effective way for fabricating Fe-based metallic glass/Cu laminated composites.

Original languageEnglish
Title of host publicationAdvances in Functional and Electronic Materials
EditorsLianjun Wang, Xiumei Wang, Kefu Yao, Guo Yan
PublisherTrans Tech Publications Ltd
Pages788-792
Number of pages5
ISBN (Print)9783037856079
DOIs
StatePublished - 2013
EventChinese Materials Congress 2012, CMC 2012 - Taiyuan, China
Duration: 13 Jul 201218 Jul 2012

Publication series

NameMaterials Science Forum
Volume745-746
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Conference

ConferenceChinese Materials Congress 2012, CMC 2012
Country/TerritoryChina
CityTaiyuan
Period13/07/1218/07/12

Keywords

  • Cu
  • Diffusion bonding
  • Laminated composites
  • Metallic glass

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