Dense depth completion based on piecewise planar model

Mengya Liu, Mingyi He, Yuchao Dai, Bo Li

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

A new method is proposed to predict a complete and dense depth map from very sparse depth measurements. Previous state-of-the-art methods tackle the problem mainly by regular sparse depth distribution and exploiting the learning-based framework, which cannot guarantee effectiveness in various scenes. To handle these drawbacks, we propose a piecewise planar model based method, which models the depth map and corresponding color images as a collection of 3D planar, then transforms the task to the optimization of the planar parameters with the energy minimization formulation. Thus, the depth values can be computed through the fitting of the planar. The method can preserve the boundaries well and get high quality visible dense depth maps. In addition, our method doesn't need the training phase thus could robustly work on any scenarios, even if the sparse depth samples are irregular distributed. Apparently, the proposed new method has two applications: depth completion for Lidar sensors and converting irregular sparse depth samples computed from Simultaneous Localization and Mapping (SLAM) to dense depth maps. The method has been tested on the KITTI dataset and achieved the competitive results, proving its effectiveness in the real problem.

Original languageEnglish
Title of host publicationProceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1806-1811
Number of pages6
ISBN (Electronic)9781538694909
DOIs
StatePublished - Jun 2019
Event14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019 - Xi'an, China
Duration: 19 Jun 201921 Jun 2019

Publication series

NameProceedings of the 14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019

Conference

Conference14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019
Country/TerritoryChina
CityXi'an
Period19/06/1921/06/19

Keywords

  • Depth Completion
  • Piecewise Planar Model
  • SLAM

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