A novel negative thermal expansion ceramic network interlayer for releasing high residual stress of Cf/SiC heterogeneous brazed joint

Pengcheng Wang, Weihan Liu, Lei Gu, Yaotian Yan, Xiaoguo Song, Jian Cao, Haiyan Chen, Wenya Li

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Fingerprint

Dive into the research topics of 'A novel negative thermal expansion ceramic network interlayer for releasing high residual stress of Cf/SiC heterogeneous brazed joint'. Together they form a unique fingerprint.

Material Science