A 0.5-6 GHz Ultra-Wideband Bidirectional Amplification and Digital Controlled Attenuation Integrated Multifunctional Chip based on 0.5μm GaAs P-HEMT Process

Cetian Wang, He Guan, Wenxu Sun, Xuejie Liao, Deyun Zhou, Yangchao Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Based on the GaAs 0.5μm pHMET process, a 0.5-6 GHz ultra-wideband amplification and attenuation multifunctional chip was developed in this paper. For the amplification unit, a Darlington-Cascode circuit structure was employed to design the transmission amplifier, while a first-stage common-source LNA structure was adopted in the reception channel. A three-stage inverted-Π type structure driven by TLL driver was employed for the digital attenuation unit. The size of the fabricated chip is 3.5×2.7×0.1mm. In the frequency range of 0.5 to 6 GHz, the chip presents a gain of 7.5dB, a P-1dB of more than 8dBm, and a noise coefficient of 4.5dB for the transmission side; meanwhile, it presents a gain of 20dB, a P-1dB of more than 16.5dBm, and a noise coefficient of 3dB for the reception side. Furthermore, the chip presents a good attenuation accuracy as less than 0.5dB at 5dB, 10dB, and 20dB attenuation degree, respectively.

Original languageEnglish
Title of host publication2024 IEEE MTT-S International Wireless Symposium, IWS 2024 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350389999
DOIs
StatePublished - 2024
Event11th IEEE MTT-S International Wireless Symposium, IWS 2024 - Beijing, China
Duration: 16 May 202419 May 2024

Publication series

Name2024 IEEE MTT-S International Wireless Symposium, IWS 2024 - Proceedings

Conference

Conference11th IEEE MTT-S International Wireless Symposium, IWS 2024
Country/TerritoryChina
CityBeijing
Period16/05/2419/05/24

Keywords

  • GaAs pHEMT
  • high integration
  • multifunctional chip
  • ultra-wideband

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