TY - JOUR
T1 - 3D Printed Flexible Strain Sensors
T2 - From Printing to Devices and Signals
AU - Liu, Haodong
AU - Zhang, Hongjian
AU - Han, Wenqi
AU - Lin, Huijuan
AU - Li, Ruizi
AU - Zhu, Jixin
AU - Huang, Wei
N1 - Publisher Copyright:
© 2021 Wiley-VCH GmbH
PY - 2021/2/24
Y1 - 2021/2/24
N2 - The revolutionary and pioneering advancements of flexible electronics provide the boundless potential to become one of the leading trends in the exploitation of wearable devices and electronic skin. Working as substantial intermediates for the collection of external mechanical signals, flexible strain sensors that get intensive attention are regarded as indispensable components in flexible integrated electronic systems. Compared with conventional preparation methods including complicated lithography and transfer printing, 3D printing technology is utilized to manufacture various flexible strain sensors owing to the low processing cost, superior fabrication accuracy, and satisfactory production efficiency. Herein, up-to-date flexible strain sensors fabricated via 3D printing are highlighted, focusing on different printing methods based on photocuring and materials extrusion, including Digital Light Processing (DLP), fused deposition modeling (FDM), and direct ink writing (DIW). Sensing mechanisms of 3D printed strain sensors are also discussed. Furthermore, the existing bottlenecks and future prospects are provided for further progressing research.
AB - The revolutionary and pioneering advancements of flexible electronics provide the boundless potential to become one of the leading trends in the exploitation of wearable devices and electronic skin. Working as substantial intermediates for the collection of external mechanical signals, flexible strain sensors that get intensive attention are regarded as indispensable components in flexible integrated electronic systems. Compared with conventional preparation methods including complicated lithography and transfer printing, 3D printing technology is utilized to manufacture various flexible strain sensors owing to the low processing cost, superior fabrication accuracy, and satisfactory production efficiency. Herein, up-to-date flexible strain sensors fabricated via 3D printing are highlighted, focusing on different printing methods based on photocuring and materials extrusion, including Digital Light Processing (DLP), fused deposition modeling (FDM), and direct ink writing (DIW). Sensing mechanisms of 3D printed strain sensors are also discussed. Furthermore, the existing bottlenecks and future prospects are provided for further progressing research.
KW - 3D printing
KW - Digital Light Processing
KW - direct ink writing
KW - flexible electronics
KW - fused deposition modeling
KW - strain sensors
UR - http://www.scopus.com/inward/record.url?scp=85099382929&partnerID=8YFLogxK
U2 - 10.1002/adma.202004782
DO - 10.1002/adma.202004782
M3 - 文献综述
C2 - 33448066
AN - SCOPUS:85099382929
SN - 0935-9648
VL - 33
JO - Advanced Materials
JF - Advanced Materials
IS - 8
M1 - 2004782
ER -