热固性树脂固化过程热膨胀与收缩系数测量装置

Translated title of the contribution: Measuring device for thermal expansion coefficient and shrinkage rate during cure process of thermosetting resin

Qun Liang, Xiping Feng, Kun Zhang, Jian Li, Xiao Hou

Research output: Contribution to journalArticlepeer-review

Fingerprint

Dive into the research topics of 'Measuring device for thermal expansion coefficient and shrinkage rate during cure process of thermosetting resin'. Together they form a unique fingerprint.

Material Science