Abstract
TC17/TC4 bonds were fabricated by plastic deformation bonding, the microstructure and mechanical properties of TC17 alloy/TC4 alloy joint interface under different joining parameters were studied by means of metallographic microscope(OM), scanning electron microscope(SEM) and unidirectional shear tests, etc. Their internal relations were analyzed and the evolution mechanism of void structure was explored. The results show that the influence of bonding pressure and bonding temperature on the void evolution, bonding ratio and shear strength of TC17 alloy/TC4 alloy bonding interface is more significant. Due to the synergism of plastic flow and atomic diffusion of TC17 alloy/TC4 alloy bonding interface, the contact area of the interface increases and generates a large local strain at the interface. The voids change from short rod shape to oval shape and then to round shape, which gradually decrease until disappear. As a result, the bonding ratio improves and the shear strength increases.
| Translated title of the contribution | Effect of plastic deformation bonding process on microstructure and mechanical properties of TC17 alloy/TC4 alloy interface |
|---|---|
| Original language | Chinese (Traditional) |
| Pages (from-to) | 3229-3238 |
| Number of pages | 10 |
| Journal | Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals |
| Volume | 33 |
| Issue number | 10 |
| DOIs | |
| State | Published - Oct 2023 |