Network
Ma Dongge
- CAS - Changchun Institute of Applied Chemistry
- South China University of Technology
- King Saud University
- University of Chinese Academy of Sciences
- Beijing Technology and Business University
External person
Ran Chenxin
- Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering
- Northwestern Polytechnical University Xian
- Xi'an Jiaotong University
- Shenzhen University
External person
Chen Yonghua
- Nanjing Tech University
- Northwestern Polytechnical University Xian
- Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering
External person
Chen Jiangshan
- CAS - Changchun Institute of Applied Chemistry
- South China University of Technology
- University of Chinese Academy of Sciences
External person
Gao Weiyin
- Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering
- Xi'an Shiyou University
- Northwestern Polytechnical University Xian
- Xi'an Jiaotong University
External person
Dong He
- Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering
- Northwestern Polytechnical University Xian
External person
Huang Wei
- Nanjing University of Posts and Telecommunications
- Nanjing Tech University
- Northwestern Polytechnical University Xian
- Xiamen University
- Fujian Normal University
- Future Display Institute in Xiamen
- Henan University
- Henan University
External person
Xu Weidong
- Nanjing University of Posts and Telecommunications
- Northwestern Polytechnical University Xian
- Linköping University
- Nanjing Tech University
- Henan University
External person
Liu Xiaowang
- Northwestern Polytechnical University Xian
- National University of Singapore
External person
Chao Lingfeng
- Nanjing Tech University
- Northwestern Polytechnical University Xian
- Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering
External person
Huang Wei
- Nanjing University of Posts and Telecommunications
- Nanjing Tech University
- Northwestern Polytechnical University Xian
- Xiamen University
- Fujian Normal University
- Future Display Institute in Xiamen
- Henan University
- Henan Institute of Flexible Electronics (HIFE)
External person
Sun Ning
- Yunnan University
- Umeå University
- Nanjing Tech University
- CAS - Changchun Institute of Applied Chemistry
External person
Qiao Xianfeng
- CAS - Changchun Institute of Applied Chemistry
- South China University of Technology
External person
Xie Guo Hua
- Jilin University
- Wuhan University
- Inner Mongolia University
- Nanjing University of Posts and Telecommunications
- University of St Andrews
- Xiamen University
External person
Yang Dezhi
- CAS - Changchun Institute of Applied Chemistry
- South China University of Technology
External person
Liu Yuan
- Beijing Information Science & Technology University
- Technische Universität Dresden
External person
Zhu Liping
- CAS - Changchun Institute of Applied Chemistry
- University of Chinese Academy of Sciences
External person
Liu Yanghua
- Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering
- Northwestern Polytechnical University Xian
External person
Niu Tingting
- Nanjing Tech University
- Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering
- Northwestern Polytechnical University Xian
External person
Hui Wei
- Northwestern Polytechnical University Xian
- Nanjing Tech University
- CAS - Shanghai Advanced Research Institute
- Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering
- Chinese Academy of Sciences
External person
Zhang Tianmu
- Jilin University
- South China University of Technology
- CAS - Changchun Institute of Applied Chemistry
External person
Sun Nan
- Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering
- Northwestern Polytechnical University Xian
External person
Sun Hengda
- Henan Academy of Sciences
- Donghua University
- CAS - Changchun Institute of Applied Chemistry
External person
Hu Wenbo
- Northwestern Polytechnical University Xian
- SUNY Buffalo
- Nanjing University of Posts and Telecommunications
- Nanjing Tech University
- Xi'an Jiaotong University
External person
Zhao Chenyang
- CAS - Changchun Institute of Applied Chemistry
- South China University of Technology
External person
Shen Yue
- Northwestern Polytechnical University Xian
- Nanjing Tech University
- Shaanxi Normal University
External person
Wei Qi
- Nanjing University of Posts and Telecommunications
- Hong Kong Polytechnic University
- Nanjing Tech University
- University of Macau
- Northwestern Polytechnical University Xian
- IMDEA Nanoscience
- Instituto IMDEA Nanociencia
External person
Xing Guichuan
- University of Macau
- Nanjing University of Posts and Telecommunications
- Nanjing Tech University
- Nanyang Technological University
- Fudan University
External person
Lv Shaoshen
- Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering
- Northwestern Polytechnical University Xian
External person
Du Jinhong
- University of Science and Technology of China
- CAS - Institute of Metal Research
External person
Li Deli
- Northwestern Polytechnical University Xian
- Fujian Normal University
- Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering
External person
Zhang Dingdong
- University of Science and Technology of China
- CAS - Institute of Metal Research
External person
Wei Ying
- Nanjing University of Posts and Telecommunications
- Heilongjiang University
- Nanjing Tech University
External person
Xu Hui
- Nanjing University of Posts and Telecommunications
- Heilongjiang University
- Fudan University
- Nanjing Tech University
- National University of Singapore
- Northwestern Polytechnical University Xian
External person
Wang Qiang
- Ministry of Education of the People's Republic of China
- Shaanxi Normal University
External person
Cheng Hui Ming
- University of Science and Technology of China
- CAS - Institute of Metal Research
- Shenzhen Institute of Advanced Technology
- Tsinghua University
External person
Ma Lai Peng
- University of Science and Technology of China
- CAS - Institute of Metal Research
External person
Gao Xingyu
- CAS - Shanghai Advanced Research Institute
- Chinese Academy of Sciences
- University of Chinese Academy of Sciences
External person
Dong Shichao
- University of Science and Technology of China
- CAS - Institute of Metal Research
External person
Ren Wencai
- University of Science and Technology of China
- CAS - Institute of Metal Research
External person
Meng Hong
- National University of Singapore
- Peking University
- Nanjing Tech University
- Northwestern Polytechnical University Xian
External person
Li Zhen
- Tianjin University
- Wuhan University
- South China University of Technology
- National University of Singapore
External person
Voit Brigitte
- Technische Universität Dresden
- Leibniz Institute of Polymer Research Dresden
External person
Wei Yuan
- Northwestern Polytechnical University Xian
- Northwest Agriculture and Forestry University
External person
Yan Yukun
- University of Science and Technology of China
- CAS - Institute of Metal Research
External person
Li Lei
- Northwestern Polytechnical University Xian
- CAS - Ningbo Institute of Material Technology and Engineering
External person
Gu Lei
- Northwestern Polytechnical University Xian
- Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering
External person
Su Meng
- Chinese Academy of Sciences
- University of Chinese Academy of Sciences
- CAS - Institute of Chemistry
External person
Zuo Shouwei
- King Abdullah University of Science and Technology
- Shaanxi University of Science and Technology
- CAS - Institute of High Energy Physics
- University of Chinese Academy of Sciences
External person
Lu Zheng Hong
- Yunnan University
- University of Toronto
- Southern University of Science and Technology
External person
Su Zhenhuang
- CAS - Shanghai Advanced Research Institute
- University of Chinese Academy of Sciences
- Chinese Academy of Sciences
External person
Liu Kaihui
- Peking University
- CAS - Institute of Physics
- University of California at Berkeley
External person
Hu Yingzhen
- Northwestern Polytechnical University Xian
- Xi'an University of Architecture and Technology
External person
Feng Xinliang
- Technische Universität Dresden
- Shanghai Jiao Tong University
- Max Planck Institute for Polymer Research
- Max Planck Institute of Microstructure Physics
External person
An Zhongfu
- Nanjing Tech University
- Nanjing University of Posts and Telecommunications
- Northwestern Polytechnical University Xian
- Jiangsu-Singapore Joint Research Center for Organic/Bio Electronics and Information Displays
- Key Laboratory for Organic Electronics and Information Displays (KLOEID)
- Key Laboratory for Organic Electronics and Information Displays (KLOEID
External person
Chen Mao Lin
- University of Science and Technology of China
- CAS - Institute of Metal Research
External person
Chen Run Feng
- Fudan University
- Nanjing University of Posts and Telecommunications
- Nanjing Tech University
- Key Laboratory for Organic Electronics and Information Displays (KLOEID)
- National University of Singapore
- Jiangsu Synergetic Innovation Center for Organic Electronics and Information Displays
- Nanjing University
- Key Laboratory for Organic Electronics and Information Displays (KLOEID
External person
Shi Wei
- Nanjing Tech University
- Nanjing University of Posts and Telecommunications
- Jiangsu-Singapore Joint Research Center for Organic/Bio Electronics and Information Displays
External person
Luo Deying
- University of Toronto
- Southern University of Science and Technology
- Peking University
- Collaborative Innovation Center of Quantum Matter
- Collaborative Innovation Center of Quantum Matter
External person
Chen Shu Fen
- Nanjing University of Posts and Telecommunications
- Northwestern Polytechnical University Xian
- Key Laboratory for Organic Electronics and Information Displays (KLOEID)
- Nanjing Tech University
External person
Sun Dong Ming
- University of Science and Technology of China
- CAS - Institute of Metal Research
External person
Karpov Yevhen
- Technische Universität Dresden
- Leibniz Institute of Polymer Research Dresden
External person
Ling Haifeng
- Nanjing University of Posts and Telecommunications
- Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM)
External person
Wang Jianpu
- Nanjing Tech University
- Strait Laboratory of Flexible Electronics (SLoFE)
- Nanjing University
External person
Zhang Jing
- CAS - Institute of Chemistry
- Beijing Institute of Technology
- CAS - Institute of High Energy Physics
- University of Chinese Academy of Sciences
External person
Yin Lichang
- CAS - Institute of Metal Research
- University of Science and Technology of China
External person
Cao Liang
- CAS - Ningbo Institute of Material Technology and Engineering
- Zhejiang Sci-Tech University
External person
Voelcker Nicolas H.
- Monash University
- CSIRO
- Victorian Node of the Australian National Fabrication Facility
- Northwestern Polytechnical University Xian
- Chinese University of Hong Kong
External person
Kiriy Anton
- Technische Universität Dresden
- Leibniz Institute of Polymer Research Dresden
External person
Zhang Qing
- University of Science and Technology of China
- CAS - Institute of Metal Research
External person
Li Bixin
- Hunan First Normal University
- Northwestern Polytechnical University Xian
- Nanjing Tech University
External person