Material Science
Finite Element Method
100%
Nanoindentation
76%
Indentation
65%
Strain Rate
61%
Silver Nanoparticle
40%
Crystal Plasticity
37%
Thermal Conductivity
30%
Silver Nanoparticle
29%
Solder Joint
28%
Creep
28%
Crack Propagation
28%
Sintering
25%
Strain Rate Effect
25%
Thin Films
22%
Power Device
22%
Fracture Behavior
22%
Fatigue of Materials
22%
Packaging Material
20%
Finite Element Modeling
20%
Fatigue Damage
19%
Low-Cycle Fatigue
18%
Damage Evolution
17%
Electronic Component
17%
Shear Strength
17%
Composite Material
17%
Lead-Free Solder
17%
Elastic Moduli
16%
Electronic Circuit
16%
Composite Material
16%
Ultimate Tensile Strength
16%
Thermal Expansion
16%
Film
15%
Single Crystal
15%
Superalloys
15%
Thermal Fatigue
15%
Fatigue Behavior
15%
Materials Property
12%
Polycrystal
11%
Plastic Deformation
10%
Volume Fraction
9%
Surface (Surface Science)
9%
Concrete (Composite Building Material)
9%
Viscoplasticity
9%
Thermal Cycling
9%
Random Vibration
7%
Plasticity Theory
7%
Crystalline Material
7%
Intermetallics
7%
Synthetic Polymer
7%
Crack Growth
7%
Engineering
Finite Element Analysis
54%
Indentation
47%
Silver Nanoparticle
30%
Constitutive Model
29%
Strain Rate
28%
Finite Element Simulation
25%
Strain Rate Effect
25%
High Strain Rate
24%
Phase Field
23%
Free Solder
23%
Packaging Material
23%
Electronic Product
22%
Interconnects
20%
Dimensionless
19%
Mesoscale
19%
Reliability Evaluation
19%
Fatigue Damage
17%
Life Prediction
17%
Deep Learning Method
17%
Polycrystalline
16%
Crack Propagation
16%
Mechanical Response
16%
Joints (Structural Components)
16%
Failure Analysis
15%
Single Crystal Superalloys
15%
Creep
15%
Low Cycle Fatigue
15%
System-in-Package
15%
Power Device
14%
Thin Films
13%
Engineering
13%
Failure Mechanism
12%
Cyclic Loading
12%
Learning System
12%
Electronic Packaging
12%
Experimental Result
11%
Porosity
11%
Level Packaging
11%
Loading Rate
10%
High Power Electronics
10%
Finite Element Modeling
10%
Split Hopkinson Pressure Bar
10%
Contact Stiffness
10%
Temperature Condition
10%
Strength Degradation
10%
Thermal Fatigue
9%
Gaussians
9%
Long Short-Term Memory
9%
Dynamic Response
9%
Composite Material
9%
