Material Science
Aluminum Oxide
6%
Carbon Dioxide
13%
Catalysis
8%
Composite Material
9%
Contact Angle
7%
Crystal Engineering
5%
Crystal Structure
17%
Density
67%
Diamond
5%
Elemental Analysis
6%
Energy Materials
9%
Enzymatic Hydrolysis
7%
Film
31%
High Energy Density
18%
HMX
15%
Hydrogen Bonding
17%
Hydrogen Peroxide
15%
Hydrophobicity
7%
Impact Resistance
18%
Ionic Liquid
100%
Laser Pulse
5%
Liquid Fuels
7%
Machining
5%
Metal-Organic Framework
13%
Molecular Structure
10%
Nuclear Magnetic Resonance
17%
Optical Property
12%
Oxidant
9%
Oxide Compound
18%
Point Defect
6%
Polishing
8%
Polysiloxane
5%
Potassium
12%
Refractive Index
9%
Scanning Electron Microscopy
5%
Self Assembly
12%
Silicon Dioxide
59%
Single Crystal X-Ray Diffraction
8%
Sol-Gel
37%
Solid Propellant
12%
Surface (Surface Science)
38%
Surface Roughness
9%
Tetraethyl Orthosilicate
6%
Thermal Stability
43%
Thermogravimetric Analysis
5%
Thin Films
9%
Water Vapor
5%
Wet Etching
5%
X-Ray Diffraction
13%
Chemistry
1,2,3-triazine
5%
Azide
6%
Carbamate
6%
Carbonylation
9%
CL-20
5%
Crystal Structure
6%
Decomposition Temperature
8%
Deuterium
6%
Differential Scanning Calorimetry
5%
Elemental Analysis
8%
Energetics
97%
Enthalpy of Formation
12%
Heterocyclic Compound
13%
Hydrogen Bonding
10%
Hydrogen Peroxide
5%
Ionic Liquid
39%
melt
8%
Metal Organic Framework
6%
Nitramine
6%
NMR Spectroscopy
10%
Picric Acid
5%
Pyrazine
8%
Pyridazine
6%
Rocket Fuel
7%
Single-Crystal X-Ray Crystallography
8%
stability
13%
Thermal Stability
24%
Thr-Asp
10%
Toxic
7%
X-Ray Diffraction
6%
Engineering
Atomic Layer Deposition
11%
Borohydride
6%
Damage Surface
5%
Delay Time
11%
Dihydrogen Ammonium Phosphate
5%
Energetics
7%
Experimental Result
9%
Femtosecond Laser
6%
Form Error
5%
Frequency Error
9%
Fused Silica
17%
Grinding (Machining)
8%
Ignition
13%
Ignition Delay
12%
Induced Damage
39%
Larger Aperture
10%
Laser Irradiation
7%
Laser System
16%
Material Removal
6%
Nanosecond
11%
Optical Surface
5%
Oxidizer
9%
Polishing Process
5%
Power Laser
16%
Silicon Dioxide
22%
Sio2 Film
7%
Sol-Gel Process
7%
Spatial Frequency
7%
Thin Films
10%
Yield Point
33%
