Use of BN-coated copper nanowires in nanocomposites with enhanced thermal conductivity and electrical insulation

Yongcun Zhou, Feng Liu, Chia Yun Chen

科研成果: 期刊稿件文章同行评审

53 引用 (Scopus)

摘要

Copper nanowires (CuNWs), as one-dimensional nanostructures, could be highly helpful as thermal management tools because of inherent thermal conductivity, high aspect ratio, and low cost. In this study, boron nitride-coated copper nanowires (CuNWs@BN) were successfully synthesized by an amenable and rapid technique and incorporated into synthetic polyimide (PI) to increase thermal conductivity while providing electrical insulation to nanocomposites. Maximal thermal conductivity in CuNWs@BN/PI composites containing fillers loading up to 20% volume rose to 4.12 W/mK, indicating an amelioration of 23 times in comparison with that of pure PI, while volume resistivity remained greater than 4.8 × 1013 Ω cm. Such nanocomposites with high thermal conductivity and electrical insulation could constitute important tools for thermal management. [Figure not available: see fulltext.]

源语言英语
页(从-至)46-50
页数5
期刊Advanced Composites and Hybrid Materials
2
1
DOI
出版状态已出版 - 15 3月 2019

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