Tuning damage model to optimize the plastic strain distribution in electronic packaging structures

Zubin Chen, Xu Long

科研成果: 书/报告/会议事项章节会议稿件同行评审

1 引用 (Scopus)

摘要

Due to the cyclic loading of thermal stress, the solder joints work in the process of cyclic fatigue, and the failure behavior of solder joints in the whole process is actually a process of damage accumulation. It is feasible to study the fatigue properties of solder joints under cyclic loading. In order to achieve accurate numerical simulations, solder constitutive models have been widely concerned. The method of coupling damage variables with a constitutive model provides an effective way to achieve this goal. Under the condition of thermal cycle loading, the damage evolution corresponding to deteriorate material properties meets the basic principle framework of thermodynamics. In this framework, the damage evolution model can be derived by using continuum damage mechanics. This model is greatly simplified by averaging the micro defects of materials, as long as the established model and its derived evolution model can solve engineering problems. Based on the theoretical framework of damage constitutive model, a UMAT user material subroutine suitable for ABAQUS finite element software is completed. Through the secondary development interface of ABAQUS, the viscoplastic constitutive model parameters of coupling damage are continuously optimized, so as to achieve better simulations of the solder fatigue process. Based on the study of the coupled damage constitutive model, the UMAT is applied to the calculation of BGA packaging structure to further reflect the optimization capacity of the model for solder fatigue performance with simulation results as a good fit to the test results.

源语言英语
主期刊名2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020
出版商Institute of Electrical and Electronics Engineers Inc.
394-398
页数5
ISBN(电子版)9781728189116
DOI
出版状态已出版 - 2 12月 2020
活动22nd IEEE Electronics Packaging Technology Conference, EPTC 2020 - Virtual, Singapore, 新加坡
期限: 2 12月 20204 12月 2020

出版系列

姓名2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020

会议

会议22nd IEEE Electronics Packaging Technology Conference, EPTC 2020
国家/地区新加坡
Virtual, Singapore
时期2/12/204/12/20

指纹

探究 'Tuning damage model to optimize the plastic strain distribution in electronic packaging structures' 的科研主题。它们共同构成独一无二的指纹。

引用此