TY - GEN
T1 - Tuning damage model to optimize the plastic strain distribution in electronic packaging structures
AU - Chen, Zubin
AU - Long, Xu
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/12/2
Y1 - 2020/12/2
N2 - Due to the cyclic loading of thermal stress, the solder joints work in the process of cyclic fatigue, and the failure behavior of solder joints in the whole process is actually a process of damage accumulation. It is feasible to study the fatigue properties of solder joints under cyclic loading. In order to achieve accurate numerical simulations, solder constitutive models have been widely concerned. The method of coupling damage variables with a constitutive model provides an effective way to achieve this goal. Under the condition of thermal cycle loading, the damage evolution corresponding to deteriorate material properties meets the basic principle framework of thermodynamics. In this framework, the damage evolution model can be derived by using continuum damage mechanics. This model is greatly simplified by averaging the micro defects of materials, as long as the established model and its derived evolution model can solve engineering problems. Based on the theoretical framework of damage constitutive model, a UMAT user material subroutine suitable for ABAQUS finite element software is completed. Through the secondary development interface of ABAQUS, the viscoplastic constitutive model parameters of coupling damage are continuously optimized, so as to achieve better simulations of the solder fatigue process. Based on the study of the coupled damage constitutive model, the UMAT is applied to the calculation of BGA packaging structure to further reflect the optimization capacity of the model for solder fatigue performance with simulation results as a good fit to the test results.
AB - Due to the cyclic loading of thermal stress, the solder joints work in the process of cyclic fatigue, and the failure behavior of solder joints in the whole process is actually a process of damage accumulation. It is feasible to study the fatigue properties of solder joints under cyclic loading. In order to achieve accurate numerical simulations, solder constitutive models have been widely concerned. The method of coupling damage variables with a constitutive model provides an effective way to achieve this goal. Under the condition of thermal cycle loading, the damage evolution corresponding to deteriorate material properties meets the basic principle framework of thermodynamics. In this framework, the damage evolution model can be derived by using continuum damage mechanics. This model is greatly simplified by averaging the micro defects of materials, as long as the established model and its derived evolution model can solve engineering problems. Based on the theoretical framework of damage constitutive model, a UMAT user material subroutine suitable for ABAQUS finite element software is completed. Through the secondary development interface of ABAQUS, the viscoplastic constitutive model parameters of coupling damage are continuously optimized, so as to achieve better simulations of the solder fatigue process. Based on the study of the coupled damage constitutive model, the UMAT is applied to the calculation of BGA packaging structure to further reflect the optimization capacity of the model for solder fatigue performance with simulation results as a good fit to the test results.
UR - http://www.scopus.com/inward/record.url?scp=85100160076&partnerID=8YFLogxK
U2 - 10.1109/EPTC50525.2020.9314995
DO - 10.1109/EPTC50525.2020.9314995
M3 - 会议稿件
AN - SCOPUS:85100160076
T3 - 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020
SP - 394
EP - 398
BT - 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd IEEE Electronics Packaging Technology Conference, EPTC 2020
Y2 - 2 December 2020 through 4 December 2020
ER -