TY - GEN
T1 - Three-Dimensional Silicon Based SIP Design of the Four-Channel Phased Array Radar TR Module for Ka-band Applications
AU - Gao, Yanhong
AU - Chen, Dongbo
AU - Xia, Yihao
AU - Kong, Qingyu
AU - Chen, Zeyuan
AU - Liu, Zhongpeng
AU - Zhou, Shigang
AU - Lu, Xilong
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - This paper presents a three-dimensional silicon based SIP (System in Package) design of the four-channel phased array radar TR module for Ka-band applications. The SIP is manufactured using high-precision Micro-Electro-Mechanical Systems (MEMS) technology, and integrates lowloss Through-Silicon Via (TSV) vertical interconnection structures, power dividers, amplitude and phase control multifunctional chips, limiter chips, power amplifier chips, low-noise amplifier chips, and various power management chips. This SIP supports free switching among three different operating modes: transmit, receive, and load. The measured results indicate that all performance indicators meet the design requirements.
AB - This paper presents a three-dimensional silicon based SIP (System in Package) design of the four-channel phased array radar TR module for Ka-band applications. The SIP is manufactured using high-precision Micro-Electro-Mechanical Systems (MEMS) technology, and integrates lowloss Through-Silicon Via (TSV) vertical interconnection structures, power dividers, amplitude and phase control multifunctional chips, limiter chips, power amplifier chips, low-noise amplifier chips, and various power management chips. This SIP supports free switching among three different operating modes: transmit, receive, and load. The measured results indicate that all performance indicators meet the design requirements.
KW - Micro-Electro-Mechanical Systems (MEMS)
KW - multifunctional module
KW - System-in-Package (SiP)
UR - http://www.scopus.com/inward/record.url?scp=85205737189&partnerID=8YFLogxK
U2 - 10.1109/ICEICT61637.2024.10671028
DO - 10.1109/ICEICT61637.2024.10671028
M3 - 会议稿件
AN - SCOPUS:85205737189
T3 - 2024 IEEE 7th International Conference on Electronic Information and Communication Technology, ICEICT 2024
SP - 449
EP - 451
BT - 2024 IEEE 7th International Conference on Electronic Information and Communication Technology, ICEICT 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 7th IEEE International Conference on Electronic Information and Communication Technology, ICEICT 2024
Y2 - 31 July 2024 through 2 August 2024
ER -