Thermophysical properties and rapid solidification of an undercooled liquid hexabasic Ni-based alloy

J. Chang, H. P. Wang, K. Zhou, B. Wei

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7 引用 (Scopus)

摘要

The surface tension and specific heat of liquid Ni-5%Cu-5%Fe-5%Co-5%Sn-5%Ge hexabasic alloy were measured over a broad range of temperature. The maximum undercooling obtained in the experiments is 363 K (0.22 T L). The surface tension value is determined as 1.460 N m-1 at the liquidus temperature of 1652 K, while its temperature coefficient is-6.361 × 10-4 N m-1K-1. The specific heat value is determined to be 41.49 ± 1.210 J mol-1K-1 in the temperature range from 1289 to 1850 K. The dendritic growth velocity of-Ni solid solution phase within the liquid alloy was measured as a function of undercooling, which attains 25.4 m s-1 at the undercooling of 358 K. The rapid dendritic growth results in the significant solute trapping of all the five solutes. The lattice constant of-Ni solid solution phase is found to increase with the extent of solute trapping. A microstructural morphology transition occurs from well-branched dendrites into equiaxed grains with the rise of undercooling.

源语言英语
页(从-至)254-263
页数10
期刊Philosophical Magazine Letters
93
5
DOI
出版状态已出版 - 1 5月 2013

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