TY - GEN
T1 - Thermo-visco-plastic constitutive model for lead-containing and lead-free solders subjected to monotonic and cyclic loadings
AU - Long, Xu
AU - Chen, Bingjie
AU - Yao, Yao
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/10/4
Y1 - 2016/10/4
N2 - Structural reliability issues attract more and more attentions with the rapid development of electronic packaging industry. As the most venerable part of electronic packaging structure, the mechanical reliability of solder joints is greatly relevant to the system reliability of electronic products. The mechanical properties of solder materials have to be reasonably evaluated if numerical simulations are preferred compared with experimental studies. In the present study, a thermo-visco-plastic constitutive model is proposed for both lead-containing and lead-free solders under monotonic and cyclic loading conditions. Due to a simple formulation form and only a few parameters, the proposed thermo-visco-plastic constitutive model can be implemented into finite element software at minor effort and the determination of parameters can be achieved conveniently by regression to experimental data. The validations against experimental data show that the proposed model is capable of well simulating the tensile behavior of various solder materials at different strain rates and working temperatures. In addition, the required parameters in the proposed model are proved to be well defined as good changing patterns are achieved by revealing the intrinsic characteristic properties of solder material under various conditions.
AB - Structural reliability issues attract more and more attentions with the rapid development of electronic packaging industry. As the most venerable part of electronic packaging structure, the mechanical reliability of solder joints is greatly relevant to the system reliability of electronic products. The mechanical properties of solder materials have to be reasonably evaluated if numerical simulations are preferred compared with experimental studies. In the present study, a thermo-visco-plastic constitutive model is proposed for both lead-containing and lead-free solders under monotonic and cyclic loading conditions. Due to a simple formulation form and only a few parameters, the proposed thermo-visco-plastic constitutive model can be implemented into finite element software at minor effort and the determination of parameters can be achieved conveniently by regression to experimental data. The validations against experimental data show that the proposed model is capable of well simulating the tensile behavior of various solder materials at different strain rates and working temperatures. In addition, the required parameters in the proposed model are proved to be well defined as good changing patterns are achieved by revealing the intrinsic characteristic properties of solder material under various conditions.
KW - finite element simulation
KW - lead-containing solder
KW - lead-free solder
KW - monotonic and cyclic loadings
KW - Thermo-visco-plastic constitutive model
UR - http://www.scopus.com/inward/record.url?scp=84994070633&partnerID=8YFLogxK
U2 - 10.1109/ICEPT.2016.7583084
DO - 10.1109/ICEPT.2016.7583084
M3 - 会议稿件
AN - SCOPUS:84994070633
T3 - 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016
SP - 31
EP - 36
BT - 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016
A2 - Bi, Keyun
A2 - Liu, Sheng
A2 - Zhou, Shengjun
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 17th International Conference on Electronic Packaging Technology, ICEPT 2016
Y2 - 16 August 2016 through 19 August 2016
ER -