Thermal fatigue life analysis of defective solder joints based on engelmaier fatigue model

Jianwei Zuo, Guicui Fu, Yutai Su, Maogong Jiang

科研成果: 书/报告/会议事项章节会议稿件同行评审

1 引用 (Scopus)

摘要

Voids in solder joints are considered to be one of the major defects in electronics assembly. And it's very important to screen out unqualified solder joints. However, the existing criteria for void defect screening depend on experience. Our work introduced here is to study the relationship between the thermal fatigue life of the solder joint and the void size. This paper focused on the effect of different size defective solder joints on electronic product life. And this research choose Engelmaier model, a strain-range-based fatigue model, to study the fatigue life of defective solder joints. The required solder joint strain in the Engelmaier model is obtained by the simulation carried out in this paper.

源语言英语
主期刊名2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
出版商Institute of Electrical and Electronics Engineers Inc.
1-3
页数3
ISBN(电子版)9781538612385
DOI
出版状态已出版 - 2 7月 2017
已对外发布
活动2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 - Haining, Zhejiang, 中国
期限: 14 12月 201716 12月 2017

出版系列

姓名2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
2018-January

会议

会议2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
国家/地区中国
Haining, Zhejiang
时期14/12/1716/12/17

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