Thermal fatigue failure analysis and life assessment of Ni-based single crystal superalloys with film cooling holes

The transient thermal fatigue behavior of Ni-based single crystal superalloys with film cooling holes under different peak temperatures (25 °C → 980 °C and 25 °C → 1050 °C) were investigated by a combination of test and finite element simulation. The initiation position and propagation direction of thermal fatigue cracks in both single hole and multi-hole specimens exhibit the angles of ± 45° with respect to the horizontal direction at the four corners of the holes. Octahedral slip failure mainly occurred at the crack initiation location and crack tip. The cyclic oxidation around the film cooling hole promotes the initiation and propagation of cracks. Based on the crystallographic theory, the strain–stress constitutive equation of the Ni-based single crystal superalloy under transient thermal shock was established. The location and evolution of thermal stress around the hole at different temperatures were obtained by finite element calculation. The kinetic behavior of cyclic oxidation has been quantitatively characterized. A thermal fatigue crack initiation life model considering heating temperature, transient thermal stress, and cyclic oxidation has been established. The simulation results are in good agreement with the tests.