TY - JOUR
T1 - Tailoring grain refinement through thickness in magnesium alloy via stationary shoulder friction stir processing and copper backing plate
AU - Patel, Vivek
AU - Li, Wenya
AU - Liu, Xichang
AU - Wen, Quan
AU - Su, Yu
AU - Shen, Junjun
AU - Fu, Banglong
N1 - Publisher Copyright:
© 2020 Elsevier B.V.
PY - 2020/5/15
Y1 - 2020/5/15
N2 - To develop ultrafine grains (UFG) in 6.35 mm thick magnesium alloy, stationary shoulder friction stir processing (SSFSP) with steel and copper backing plates was conducted. Steel backing plate produced uniform fine grains (FG) size of 4.98, 4.75, 4.12 μm in top, middle, bottom of the stir zone (SZ), respectively. In contrast, copper backing plate tailored microstructure from FG (4.1 μm) in the top to UFG (0.96 μm) in the bottom of SZ. SSFSP produced uniform and gradient microstructures, altering temperature gradient by placing steel and copper backing plates, respectively. It is worth to note that UFG microstructure achieved without usage of external cooling, owning to the copper backing plate. Most of the grains found under ~2 μm size in UFG microstructure. FG and UFG microstructures contributed to the enhancement in the ductility and strength, respectively. UFG resulted in significant improvement in hardness and tensile strength by ~80% and 24% of the base material, respectively. The intensity of strong basal texture throughout the thickness found independent of the backing plate type. Microstructure evolutions across the SZ thickness for both processing conditions are discussed using electron back scattered diffraction (EBSD).
AB - To develop ultrafine grains (UFG) in 6.35 mm thick magnesium alloy, stationary shoulder friction stir processing (SSFSP) with steel and copper backing plates was conducted. Steel backing plate produced uniform fine grains (FG) size of 4.98, 4.75, 4.12 μm in top, middle, bottom of the stir zone (SZ), respectively. In contrast, copper backing plate tailored microstructure from FG (4.1 μm) in the top to UFG (0.96 μm) in the bottom of SZ. SSFSP produced uniform and gradient microstructures, altering temperature gradient by placing steel and copper backing plates, respectively. It is worth to note that UFG microstructure achieved without usage of external cooling, owning to the copper backing plate. Most of the grains found under ~2 μm size in UFG microstructure. FG and UFG microstructures contributed to the enhancement in the ductility and strength, respectively. UFG resulted in significant improvement in hardness and tensile strength by ~80% and 24% of the base material, respectively. The intensity of strong basal texture throughout the thickness found independent of the backing plate type. Microstructure evolutions across the SZ thickness for both processing conditions are discussed using electron back scattered diffraction (EBSD).
KW - Copper backing plate
KW - Friction stir processing
KW - Grain refinement
KW - Stationary shoulder
KW - Ultrafine grained microstructure
UR - http://www.scopus.com/inward/record.url?scp=85082927200&partnerID=8YFLogxK
U2 - 10.1016/j.msea.2020.139322
DO - 10.1016/j.msea.2020.139322
M3 - 文章
AN - SCOPUS:85082927200
SN - 0921-5093
VL - 784
JO - Materials Science and Engineering: A
JF - Materials Science and Engineering: A
M1 - 139322
ER -