Synchronously improved electromagnetic interference shielding and thermal conductivity for epoxy nanocomposites by constructing 3D copper nanowires/thermally annealed graphene aerogel framework

Xutong Yang, Shuguang Fan, Ying Li, Yongqiang Guo, Yunge Li, Kunpeng Ruan, Shengmao Zhang, Junliang Zhang, Jie Kong, Junwei Gu

科研成果: 期刊稿件文章同行评审

582 引用 (Scopus)

摘要

3D copper nanowires-thermally annealed graphene aerogel (CuNWs-TAGA) framework is firstly prepared by freeze-drying followed by thermal annealing from CuNWs, graphene oxide (GO) and L-ascorbic acid. Epoxy resin is then poured back into the above 3D CuNWs-TAGA framework to fabricate the CuNWs-TAGA/epoxy nanocomposites. CuNWs with average diameter of about 120 nm and length of approximate 10 μm are successfully prepared. When the mass fraction of CuNWs-TAGA is 7.2 wt% (6.0–1.2 wt% CuNWs-TAGA), the thermal conductivity coefficient (λ) value of the CuNWs-TAGA/epoxy nanocomposites reaches the maximum of 0.51 W/mK. Meantime, the CuNWs-TAGA/epoxy nanocomposites exhibit the maximum electromagnetic interference shielding effectiveness (EMI SE) value of 47 dB and electrical conductivity (σ) of 120.8 S/m, ascribed to perfect 3D CuNWs-TAGA conductive network structures. Meanwhile, the corresponding elasticity modulus, hardness, glass transition temperature (Tg) and heat-resistance index (THRI) of the CuNWs-TAGA/epoxy nanocomposites increase to 4.69 GPa, 0.33 GPa, 126.3 °C and 181.7 °C, respectively.

源语言英语
文章编号105670
期刊Composites Part A: Applied Science and Manufacturing
128
DOI
出版状态已出版 - 1月 2020

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