Studies on the preparation of polystyrene thermal conductivity composites

Various thermally conductive fillers including aluminum oxide(Al₂O₃), magnesium oxide(MgO), b-silicon carbide particle(β-SiCp) and β-silicon carbide whisker(β-SiCw) were used to prepare polystyrene thermal conductivity composites. Experimental results showed that, for given filler loading, the thermal conductivity of the composites was higher for PS flake than that of PS particle, and the thermal conductivity was optimal by powder blending method. The SiCw filler was more favorable to improve the thermal conductivity of the composites; a much higher thermal conductivity of 1.18W/mK could be achieved for the composite with 40 vol% SiCw, about six times higher than that of native polystyrene. The experimental thermal conductivity values were in agreement with those predicted by lower bound of Maxwell-Eueken model. For given SiC loading, the thermal conductivity increased with the increasing shape parameter of n. The SiCw was much easier to form the thermal conductivity chains and network than that of SiCp.