Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonator for Harsh Environment Application

Baoyun Sun; Jiarui Mo; Hemin Zhang; Henk W. Van Zeijl; Willem D. Van Driel; Guoqi Zhang

doi:10.1109/MEMS49605.2023.10052401

Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonator for Harsh Environment Application

Baoyun Sun, Jiarui Mo, Hemin Zhang, Henk W. Van Zeijl, Willem D. Van Driel, Guoqi Zhang

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

2 引用（Scopus）

摘要

The thermal-piezoresistive effect in silicon (Si) has attracted great attention toward high-performance resonant devices but still faces major challenges for harsh environment applications. Instead of using Si, this paper, for the first time, reports a thermal-piezoresistive resonator based on a silicon carbide-on-insulator (SiCOI) platform. The resonance frequency simulation, CMOS-compatible fabrication, and thermoresistive properties characterization of the proposed SiCOI resonator are presented. The experimental results show linear current-voltage characteristics and a constant temperature coefficient of resistance (TCR) up to 200 °C.

源语言	英语
主期刊名	2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023
出版商	Institute of Electrical and Electronics Engineers Inc.
页	621-624
页数	4
ISBN（电子版）	9781665493086
DOI	https://doi.org/10.1109/MEMS49605.2023.10052401
出版状态	已出版 - 2023
已对外发布	是
活动	36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023 - Munich, 德国期限: 15 1月 2023 → 19 1月 2023

出版系列

姓名	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
卷	2023-January
ISSN（印刷版）	1084-6999

会议

会议	36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023
国家/地区	德国
市	Munich
时期	15/01/23 → 19/01/23

访问文件

10.1109/MEMS49605.2023.10052401

其它文件与链接

链接到 Scopus 的出版物

引用此

Sun, B., Mo, J., Zhang, H., Van Zeijl, H. W., Van Driel, W. D., & Zhang, G. (2023). Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonator for Harsh Environment Application. 在 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023 (页码 621-624). (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); 卷 2023-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMS49605.2023.10052401

Sun, Baoyun ; Mo, Jiarui ; Zhang, Hemin 等. / Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonator for Harsh Environment Application. 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023. Institute of Electrical and Electronics Engineers Inc., 2023. 页码 621-624 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

@inproceedings{97527a330586437b898ff30a87481003,

title = "Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonator for Harsh Environment Application",

abstract = "The thermal-piezoresistive effect in silicon (Si) has attracted great attention toward high-performance resonant devices but still faces major challenges for harsh environment applications. Instead of using Si, this paper, for the first time, reports a thermal-piezoresistive resonator based on a silicon carbide-on-insulator (SiCOI) platform. The resonance frequency simulation, CMOS-compatible fabrication, and thermoresistive properties characterization of the proposed SiCOI resonator are presented. The experimental results show linear current-voltage characteristics and a constant temperature coefficient of resistance (TCR) up to 200 °C.",

keywords = "harsh environment, resonator, Silicon carbide-on-insulator, thermal-piezoresistive",

author = "Baoyun Sun and Jiarui Mo and Hemin Zhang and {Van Zeijl}, {Henk W.} and {Van Driel}, {Willem D.} and Guoqi Zhang",

note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023 ; Conference date: 15-01-2023 Through 19-01-2023",

year = "2023",

doi = "10.1109/MEMS49605.2023.10052401",

language = "英语",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "621--624",

booktitle = "2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023",

}

Sun, B, Mo, J, Zhang, H, Van Zeijl, HW, Van Driel, WD & Zhang, G 2023, Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonator for Harsh Environment Application. 在 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 卷 2023-January, Institute of Electrical and Electronics Engineers Inc., 页码 621-624, 36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023, Munich, 德国, 15/01/23. https://doi.org/10.1109/MEMS49605.2023.10052401

Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonator for Harsh Environment Application. / Sun, Baoyun; Mo, Jiarui; Zhang, Hemin 等.
2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023. Institute of Electrical and Electronics Engineers Inc., 2023. 页码 621-624 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); 卷 2023-January).

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

TY - GEN

T1 - Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonator for Harsh Environment Application

AU - Sun, Baoyun

AU - Mo, Jiarui

AU - Zhang, Hemin

AU - Van Zeijl, Henk W.

AU - Van Driel, Willem D.

AU - Zhang, Guoqi

PY - 2023

Y1 - 2023

N2 - The thermal-piezoresistive effect in silicon (Si) has attracted great attention toward high-performance resonant devices but still faces major challenges for harsh environment applications. Instead of using Si, this paper, for the first time, reports a thermal-piezoresistive resonator based on a silicon carbide-on-insulator (SiCOI) platform. The resonance frequency simulation, CMOS-compatible fabrication, and thermoresistive properties characterization of the proposed SiCOI resonator are presented. The experimental results show linear current-voltage characteristics and a constant temperature coefficient of resistance (TCR) up to 200 °C.

AB - The thermal-piezoresistive effect in silicon (Si) has attracted great attention toward high-performance resonant devices but still faces major challenges for harsh environment applications. Instead of using Si, this paper, for the first time, reports a thermal-piezoresistive resonator based on a silicon carbide-on-insulator (SiCOI) platform. The resonance frequency simulation, CMOS-compatible fabrication, and thermoresistive properties characterization of the proposed SiCOI resonator are presented. The experimental results show linear current-voltage characteristics and a constant temperature coefficient of resistance (TCR) up to 200 °C.

KW - harsh environment

KW - resonator

KW - Silicon carbide-on-insulator

KW - thermal-piezoresistive

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T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SP - 621

EP - 624

BT - 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023

Y2 - 15 January 2023 through 19 January 2023

ER -

Sun B, Mo J, Zhang H, Van Zeijl HW, Van Driel WD, Zhang G. Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonator for Harsh Environment Application. 在 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023. Institute of Electrical and Electronics Engineers Inc. 2023. 页码 621-624. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMS49605.2023.10052401

Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonator for Harsh Environment Application

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