TY - JOUR
T1 - Response of Silicon Nitride Ceramics under High-enthalpy Plasma Flows
AU - Guan, Jiasuo
AU - Cheng, Laifei
AU - Wang, Yaohui
N1 - Publisher Copyright:
© 2018, Wuhan University of Technology and Springer-Verlag GmbH Germany, part of Springer Nature.
PY - 2018/8/1
Y1 - 2018/8/1
N2 - Silicon nitride ceramics were prepared by means of a hot-press sintering method. The ablation behavior was studied by plasma wind tunnel tests. The data suggested that, under low heat flux and stagnation pressure conditions, the ablation process was controlled by the atomic oxidation of Si3N4, leading to the elimination of Si3N4. By contrast, the erosion was mainly produced by the decomposition of Si3N4 under high heat flux and stagnation pressure conditions. Under these conditions, a fraction of Si phase, formed upon decomposition of Si3N4, was volatilized. The remained Si had melted due to high temperatures and scoured away from stagnation point area, generating mushroom-shaped samples.
AB - Silicon nitride ceramics were prepared by means of a hot-press sintering method. The ablation behavior was studied by plasma wind tunnel tests. The data suggested that, under low heat flux and stagnation pressure conditions, the ablation process was controlled by the atomic oxidation of Si3N4, leading to the elimination of Si3N4. By contrast, the erosion was mainly produced by the decomposition of Si3N4 under high heat flux and stagnation pressure conditions. Under these conditions, a fraction of Si phase, formed upon decomposition of Si3N4, was volatilized. The remained Si had melted due to high temperatures and scoured away from stagnation point area, generating mushroom-shaped samples.
KW - ablation
KW - plasma wind tunnel
KW - silicon nitride
UR - http://www.scopus.com/inward/record.url?scp=85049877220&partnerID=8YFLogxK
U2 - 10.1007/s11595-018-1900-2
DO - 10.1007/s11595-018-1900-2
M3 - 文章
AN - SCOPUS:85049877220
SN - 1000-2413
VL - 33
SP - 828
EP - 835
JO - Journal Wuhan University of Technology, Materials Science Edition
JF - Journal Wuhan University of Technology, Materials Science Edition
IS - 4
ER -