Research on thermal conduction and mechanical properties for carbon foam

The phenolic resin foam was prepared by using hollow phenolic resin microspher which was made by microcapsule. And under the protection of Ar, the microcapsules were carbonized at 1000°C and graphite at 2000°C, then the foam was got. Herein the porosity and the effect of heat treatment temperature on carbon foam were investigated. And the results show that the porosity incensement can reduce the thermal conduction of material, and the low thermal conduction foam is obtained by using this method. However, for the materials with approximative porosity, the thermal conduction is decreased by reducing aperture of material. Finally, the foam material is obtained with density of 0.50g/cm³, thermal conduction of 1.007W/m·K and compressive strength of 8.82MPa.