Research on the design methodology of accelerated thermal cycling test for train electronic assemblies basing on PoF

Recently thermal cycling tests for train electronic assemblies have been widely applied to eliminating latent defects and improving the reliability of the electronics. Considering the cost and schedule, accelerate thermal cycling (ATC) tests are conducted instead of normal tests. In this paper, the design methodology of ATC tests for electronic assemblies is studied. Moreover, the procedure of test design is established basing on Physics of Failure (PoF). The thermal cycling condition feature matrix and the electronic assemblies feature matrix are defined. Using Engelmaier model, the electronic assemblies life feature matrix in both normal and accelerate temperature conditions are consequently calculated. Comparing the two life prediction results, ATC test scheme equivalent to the normal test is determined. What's more, the ATC test scheme for a train traction monitor parameter acquisition circuit is designed as a case study.