TY - JOUR
T1 - Preparation and characterization of 2MMZ-PS microcapsule-type latent curing agent
AU - Shi, Youqiang
AU - Zhang, Qiuyu
AU - Yin, Yanan
AU - Yin, Changjie
AU - Zhang, Baoliang
AU - Gu, Junwei
PY - 2011/9
Y1 - 2011/9
N2 - A novel heat released microcapsule-type latent curing agent was prepared by solvent evaporation technique with 2-methylimidazole(2MMZ) as core material and polystyrene(PS) as wall material. The chemical structure, core material content, surface morphology, size distribution and curing characteristics of this microcapsule-type curing agent were characterized by FT-IR, TGA, SEM, granulometer and DSC. The obtained microcapsules had a smooth surface and displayed a narrow size distribution with the mean size about 10.18 μm, and its core material content was about 40.36%. In addition, the one-component adhesive made from the microcapsules and epoxy resin E-51 showed excellent curing characteristics and latent properties. It was found that the E-51/2MMZ-PS microcapsule system could be cured at 100°C in 1 h and its shelf life at room temperature was more than 1 month.
AB - A novel heat released microcapsule-type latent curing agent was prepared by solvent evaporation technique with 2-methylimidazole(2MMZ) as core material and polystyrene(PS) as wall material. The chemical structure, core material content, surface morphology, size distribution and curing characteristics of this microcapsule-type curing agent were characterized by FT-IR, TGA, SEM, granulometer and DSC. The obtained microcapsules had a smooth surface and displayed a narrow size distribution with the mean size about 10.18 μm, and its core material content was about 40.36%. In addition, the one-component adhesive made from the microcapsules and epoxy resin E-51 showed excellent curing characteristics and latent properties. It was found that the E-51/2MMZ-PS microcapsule system could be cured at 100°C in 1 h and its shelf life at room temperature was more than 1 month.
KW - Epoxy resin
KW - Latent curing agent
KW - Microcapsule
KW - Solvent volatilization method
UR - http://www.scopus.com/inward/record.url?scp=80052801437&partnerID=8YFLogxK
U2 - 10.3969/j.issn.0438-1157.2011.09.039
DO - 10.3969/j.issn.0438-1157.2011.09.039
M3 - 文章
AN - SCOPUS:80052801437
SN - 0438-1157
VL - 62
SP - 2651
EP - 2656
JO - Huagong Xuebao/Journal of Chemical Industry and Engineering (China)
JF - Huagong Xuebao/Journal of Chemical Industry and Engineering (China)
IS - 9
ER -