Phase evolution of diffusion bonding interface between high Nb containing TiAl alloy and Ni-Cr-W superalloy

Xiansheng Qi, Xiangyi Xue, Bin Tang, Hongchao Kou, Rui Hu, Jinshan Li

科研成果: 期刊稿件文章同行评审

18 引用 (Scopus)

摘要

The diffusion bonding between high Nb containing TiAl alloy and Ni-Cr-W superalloy was carried out under the condition of 1000℃-50 MPa-60 min. The microstructure and the composition of diffusion bonding interface were characterized by optical microscope (OM), scanning electron microscope (SEM), energy disperse spectroscopy (EDS) and X-Ray diffraction (XRD). The phase evolutions of bonds with and without Ti/Cu interlayers were analyzed. The results indicate that the interfacial phases of high Nb containing TiAl alloy/Ni-Cr-W superalloy joint consist of γ-TiAl, Ni2AlTi, Ni3Ti, (NiCr)ss (ss represents solid solution), γ phase, while the interfacial phases of joint with Ti/Cu interlayers consist of Ti3Al, Tiss, Ti2Ni, rich Cu-NiAlTi, α2-Wss, Ni2AlTi, (NiCr)ss, γ phase. Besides, Cr and W atoms are concentrated in the zone near Ni-Cr-W superalloy because their diffusion is difficult. Ti/Cu foils can promote diffusion and reaction; therefore the micro-cracks in the bonded joint will be avoided efficiently.

源语言英语
页(从-至)1575-1580
页数6
期刊Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering
44
7
出版状态已出版 - 1 7月 2015

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