TY - JOUR
T1 - On the Nonequilibrium Interface Kinetics of Rapid Coupled Eutectic Growth
AU - Dong, H.
AU - Chen, Y. Z.
AU - Shan, G. B.
AU - Zhang, Z. R.
AU - Liu, F.
N1 - Publisher Copyright:
© 2017, The Minerals, Metals & Materials Society and ASM International.
PY - 2017/8/1
Y1 - 2017/8/1
N2 - Nonequilibrium interface kinetics (NEIK) is expected to play an important role in coupled growth of eutectic alloys, when solidification velocity is high and intermetallic compound or topologically complex phases form in the crystallized product. In order to quantitatively evaluate the effect of NEIK on the rapid coupled eutectic growth, in this work, two nonequilibrium interface kinetic effects, i.e., atom attachment and solute trapping at the solid–liquid interface, were incorporated into the analyses of the coupled eutectic growth under the rapid solidification condition. First, a coupled growth model incorporating the preceding two nonequilibrium kinetic effects was derived. On this basis, an expression of kinetic undercooling (∆Tk), which is used to characterize the NEIK, was defined. The calculations based on the as-derived couple growth model show good agreement with the reported experimental results achieved in rapidly solidified eutectic Al-Sm alloys consisting of a solid solution phase (α-Al) and an intermetallic compound phase (Al11Sm3). In terms of the definition of ∆Tk defined in this work, the role of NEIK in the coupled growth of the Al-Sm eutectic system was analyzed. The results show that with increasing the coupled growth velocity, ∆Tk increases continuously, and its ratio to the total undercooling reaches 0.32 at the maximum growth velocity for coupled eutectic growth. Parametric analyses on two key alloy parameters that influence ∆Tk, i.e., interface kinetic parameter (μi) and solute distribution coefficient (ke), indicate that both μi and ke influence the NEIK significantly and the decrease of either these two parameters enhances the NEIK effect.
AB - Nonequilibrium interface kinetics (NEIK) is expected to play an important role in coupled growth of eutectic alloys, when solidification velocity is high and intermetallic compound or topologically complex phases form in the crystallized product. In order to quantitatively evaluate the effect of NEIK on the rapid coupled eutectic growth, in this work, two nonequilibrium interface kinetic effects, i.e., atom attachment and solute trapping at the solid–liquid interface, were incorporated into the analyses of the coupled eutectic growth under the rapid solidification condition. First, a coupled growth model incorporating the preceding two nonequilibrium kinetic effects was derived. On this basis, an expression of kinetic undercooling (∆Tk), which is used to characterize the NEIK, was defined. The calculations based on the as-derived couple growth model show good agreement with the reported experimental results achieved in rapidly solidified eutectic Al-Sm alloys consisting of a solid solution phase (α-Al) and an intermetallic compound phase (Al11Sm3). In terms of the definition of ∆Tk defined in this work, the role of NEIK in the coupled growth of the Al-Sm eutectic system was analyzed. The results show that with increasing the coupled growth velocity, ∆Tk increases continuously, and its ratio to the total undercooling reaches 0.32 at the maximum growth velocity for coupled eutectic growth. Parametric analyses on two key alloy parameters that influence ∆Tk, i.e., interface kinetic parameter (μi) and solute distribution coefficient (ke), indicate that both μi and ke influence the NEIK significantly and the decrease of either these two parameters enhances the NEIK effect.
UR - http://www.scopus.com/inward/record.url?scp=85020175287&partnerID=8YFLogxK
U2 - 10.1007/s11661-017-4147-1
DO - 10.1007/s11661-017-4147-1
M3 - 文章
AN - SCOPUS:85020175287
SN - 1073-5623
VL - 48
SP - 3823
EP - 3830
JO - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
JF - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
IS - 8
ER -