Microstructure and thermal expansion behavior of a novel C                         f                         -SiCNWs/AZ91D composite with dual interface

Ting Zhang; Lehua Qi; Jiawei Fu; Xujiang Chao; Wei Li; Hejun Li

doi:10.1016/j.ceramint.2019.03.073

Microstructure and thermal expansion behavior of a novel C _f -SiCNWs/AZ91D composite with dual interface

Ting Zhang, Lehua Qi, Jiawei Fu, Xujiang Chao, Wei Li, Hejun Li

材料学院

Northwestern Polytechnical University Xian

科研成果: 期刊稿件 › 文章 › 同行评审

15 引用（Scopus）

摘要

In this study, a novel composite with dual interface, namely T-700 carbon fibers grafted with SiCNWs reinforced AZ91D (C _f -SiCNWs/AZ91D), was designed. The microstructure of the C _f -SiCNWs/AZ91D composite was fully characterized and its thermal expansion behaviors from 25 to 450 °C investigated. The results show that the C _f -SiCNWs/AZ91D has dual interface of C _f /AZ91D and SiCNWs/AZ91D. In the alloy matrix, the nanowires are uniformly distributed without any agglomerates and showing a good bond with the matrix. Near the interface of SiCNWs/AZ91D, considerable dislocations were observed, which can be attributed to the different thermal expansions of SiCNWs and AZ91D matrix. It was found that the thermal expansion behavior of the C _f -SiCNWs/AZ91D composite was significantly influenced by its interfacial configuration, which can reduce the coefficients of thermal expansion and improve the stability of the composite.

源语言	英语
页（从-至）	12563-12569
页数	7
期刊	Ceramics International
卷	45
期	9
DOI	https://doi.org/10.1016/j.ceramint.2019.03.073
出版状态	已出版 - 15 6月 2019

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10.1016/j.ceramint.2019.03.073

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@article{d88b25e9ea664ac99eabf40e8694f5d8,

title = " Microstructure and thermal expansion behavior of a novel C f -SiCNWs/AZ91D composite with dual interface ",

abstract = " In this study, a novel composite with dual interface, namely T-700 carbon fibers grafted with SiCNWs reinforced AZ91D (C f -SiCNWs/AZ91D), was designed. The microstructure of the C f -SiCNWs/AZ91D composite was fully characterized and its thermal expansion behaviors from 25 to 450 °C investigated. The results show that the C f -SiCNWs/AZ91D has dual interface of C f /AZ91D and SiCNWs/AZ91D. In the alloy matrix, the nanowires are uniformly distributed without any agglomerates and showing a good bond with the matrix. Near the interface of SiCNWs/AZ91D, considerable dislocations were observed, which can be attributed to the different thermal expansions of SiCNWs and AZ91D matrix. It was found that the thermal expansion behavior of the C f -SiCNWs/AZ91D composite was significantly influenced by its interfacial configuration, which can reduce the coefficients of thermal expansion and improve the stability of the composite.",

keywords = "C -SiCNWs/AZ91D composite, Coefficient of thermal expansion, Dual interface, Microstructure, SiC nanowires",

author = "Ting Zhang and Lehua Qi and Jiawei Fu and Xujiang Chao and Wei Li and Hejun Li",

note = "Publisher Copyright: {\textcopyright} 2019 Elsevier Ltd and Techna Group S.r.l.",

year = "2019",

month = jun,

day = "15",

doi = "10.1016/j.ceramint.2019.03.073",

language = "英语",

volume = "45",

pages = "12563--12569",

journal = "Ceramics International",

issn = "0272-8842",

publisher = "Elsevier Ltd",

number = "9",

}

Microstructure and thermal expansion behavior of a novel C _f -SiCNWs/AZ91D composite with dual interface . / Zhang, Ting; Qi, Lehua; Fu, Jiawei 等.
在: Ceramics International, 卷 45, 号码 9, 15.06.2019, 页码 12563-12569.

科研成果: 期刊稿件 › 文章 › 同行评审

TY - JOUR

T1 - Microstructure and thermal expansion behavior of a novel C f -SiCNWs/AZ91D composite with dual interface

AU - Zhang, Ting

AU - Qi, Lehua

AU - Fu, Jiawei

AU - Chao, Xujiang

AU - Li, Wei

AU - Li, Hejun

PY - 2019/6/15

Y1 - 2019/6/15

N2 - In this study, a novel composite with dual interface, namely T-700 carbon fibers grafted with SiCNWs reinforced AZ91D (C f -SiCNWs/AZ91D), was designed. The microstructure of the C f -SiCNWs/AZ91D composite was fully characterized and its thermal expansion behaviors from 25 to 450 °C investigated. The results show that the C f -SiCNWs/AZ91D has dual interface of C f /AZ91D and SiCNWs/AZ91D. In the alloy matrix, the nanowires are uniformly distributed without any agglomerates and showing a good bond with the matrix. Near the interface of SiCNWs/AZ91D, considerable dislocations were observed, which can be attributed to the different thermal expansions of SiCNWs and AZ91D matrix. It was found that the thermal expansion behavior of the C f -SiCNWs/AZ91D composite was significantly influenced by its interfacial configuration, which can reduce the coefficients of thermal expansion and improve the stability of the composite.

AB - In this study, a novel composite with dual interface, namely T-700 carbon fibers grafted with SiCNWs reinforced AZ91D (C f -SiCNWs/AZ91D), was designed. The microstructure of the C f -SiCNWs/AZ91D composite was fully characterized and its thermal expansion behaviors from 25 to 450 °C investigated. The results show that the C f -SiCNWs/AZ91D has dual interface of C f /AZ91D and SiCNWs/AZ91D. In the alloy matrix, the nanowires are uniformly distributed without any agglomerates and showing a good bond with the matrix. Near the interface of SiCNWs/AZ91D, considerable dislocations were observed, which can be attributed to the different thermal expansions of SiCNWs and AZ91D matrix. It was found that the thermal expansion behavior of the C f -SiCNWs/AZ91D composite was significantly influenced by its interfacial configuration, which can reduce the coefficients of thermal expansion and improve the stability of the composite.

KW - C -SiCNWs/AZ91D composite

KW - Coefficient of thermal expansion

KW - Dual interface

KW - Microstructure

KW - SiC nanowires

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U2 - 10.1016/j.ceramint.2019.03.073

DO - 10.1016/j.ceramint.2019.03.073

M3 - 文章

AN - SCOPUS:85063043103

SN - 0272-8842

VL - 45

SP - 12563

EP - 12569

JO - Ceramics International

JF - Ceramics International

IS - 9

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Microstructure and thermal expansion behavior of a novel C f -SiCNWs/AZ91D composite with dual interface

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Microstructure and thermal expansion behavior of a novel C _f -SiCNWs/AZ91D composite with dual interface