Microstructural characteristics and mechanical properties of peritectic Cu-Sn alloy solidified within ultrasonic field

W. Zhai, Z. Y. Hong, X. L. Wen, D. L. Geng, B. Wei

科研成果: 期刊稿件文章同行评审

43 引用 (Scopus)

摘要

The dynamic solidification of peritectic Cu-70%Sn alloy was accomplished within a 20kHz ultrasonic field under the power range up to 440W. The ultrasound promotes the nucleation of primary ε(Cu3Sn) phase and prevents the bulk undercooling of liquid alloy. As sound power increases, the ultrasonic field brings about a striking size refinement effect to the primary ε intermetallic compound by more than one order of magnitude. Meanwhile, it facilitates or even completes the usual peritectic transformation (L+ε→η) which occurs only to a very limited extent during static solidification. This is mainly because the refinement of primary ε phase induced by ultrasound greatly reduces the characteristic length of peritectic microstructure, which increases solid state Fourier number by more than one order of magnitude. The dramatic increase in the volume fraction of peritectic phase and the prominent grain refinement effect due to ultrasound lead to the remarkable improvement of mechanical properties for Cu-70%Sn alloy, whose compressive strength and microhardness are increased by factors of 4.8 and 1.45, respectively.

源语言英语
页(从-至)43-50
页数8
期刊Materials and Design
72
DOI
出版状态已出版 - 5 5月 2015

指纹

探究 'Microstructural characteristics and mechanical properties of peritectic Cu-Sn alloy solidified within ultrasonic field' 的科研主题。它们共同构成独一无二的指纹。

引用此