Investigation of creep stress characterization of thin film/substrate systems with indentation method

In the present paper, the finite element simulation of a flat cylindrical indentation of thin film/ substrate systems is carried out. The aim is to understand the creep stress characterization of thin film/substrate systems, which plays an important role in the creep indentation characterization, so as to provide some foundation on determination of interface properties of thin film/substrate systems by a flat cylindrical indenter. Finite element results shows that the influence of friction between the indenter and the thin film on stress distribution can be neglected. However, the influences of the thickness of thin film and the modulus ratio of thin film to substrate on stress distribution are important.