TY - JOUR
T1 - Industrially efficient method for measuring precisely 3D microstructure of MEMS
AU - Yuan, Weizheng
AU - Wang, Xiaowei
AU - Ma, Binghe
PY - 2001/11
Y1 - 2001/11
N2 - In accordance with 3D geometric dimension measurement of a micro-machines, an image measurement method was proposed based on CCD photoelectric technique. Taking a silicon micro-cantilever as a measured object, its surface depth variation was measured based on gray gradient of image and its planar dimensions were determined based on geometric imaging principle. The experimental measurement system consisted of five modules, light image,, signal processing, digital image processing, display, and mechanical support and adjustment mechanism. Measured results show that the measurement range of the system is from millimeters to micrometers and the precision is up to 1%.
AB - In accordance with 3D geometric dimension measurement of a micro-machines, an image measurement method was proposed based on CCD photoelectric technique. Taking a silicon micro-cantilever as a measured object, its surface depth variation was measured based on gray gradient of image and its planar dimensions were determined based on geometric imaging principle. The experimental measurement system consisted of five modules, light image,, signal processing, digital image processing, display, and mechanical support and adjustment mechanism. Measured results show that the measurement range of the system is from millimeters to micrometers and the precision is up to 1%.
KW - 3D geometric size
KW - Image measurement
KW - Micro-electro-mechanical system(MEMS)
UR - http://www.scopus.com/inward/record.url?scp=0035521794&partnerID=8YFLogxK
M3 - 文章
AN - SCOPUS:0035521794
SN - 1000-2758
VL - 19
SP - 493
EP - 497
JO - Xibei Gongye Daxue Xuebao/Journal of Northwestern Polytechnical University
JF - Xibei Gongye Daxue Xuebao/Journal of Northwestern Polytechnical University
IS - 4
ER -