TY - JOUR
T1 - Improvement of thermal conductivities for PPS dielectric nanocomposites via incorporating NH2-POSS functionalized nBN fillers
AU - Yang, Xutong
AU - Tang, Lin
AU - Guo, Yongqiang
AU - Liang, Chaobo
AU - Zhang, Qiuyu
AU - Kou, Kaichang
AU - Gu, Junwei
N1 - Publisher Copyright:
© 2017 Elsevier Ltd
PY - 2017/10
Y1 - 2017/10
N2 - The proposed combining method of silane coupling agent of γ-aminopropyl triethoxy silane/aminopropyllsobutyl polyhedral oligomeric silsesquioxane (KH-560/NH2-POSS) was performed to functionalize the surface of hexagonal nanometer boron nitride fillers (f-nBN), aiming to fabricate the f-nBN/polyphenylene sulfide (f-nBN/PPS) nanocomposites with excellent thermal conductivities, outstanding thermal stabilities and optimal dielectric properties. The usage of f-nBN fillers was benifit for improving the thermally conductive coefficient (λ) and decreasing dielectric constant (ε) values of the PPS nanocomposites. The f-nBN/PPS nanocomposite with 60 wt% f-BN fillers was an excellent dielectric nanocomposite with high λ & ideal ε values and outstanding thermal stability, λ of 1.122 W/m K (increased by 400% compared to that of pristine PPS matrix), ε of 3.99 and THeat-resistance index (THRI) beyond 275 °C, which holds potential for electronic packaging materials and ultra high voltage electrical apparatus.
AB - The proposed combining method of silane coupling agent of γ-aminopropyl triethoxy silane/aminopropyllsobutyl polyhedral oligomeric silsesquioxane (KH-560/NH2-POSS) was performed to functionalize the surface of hexagonal nanometer boron nitride fillers (f-nBN), aiming to fabricate the f-nBN/polyphenylene sulfide (f-nBN/PPS) nanocomposites with excellent thermal conductivities, outstanding thermal stabilities and optimal dielectric properties. The usage of f-nBN fillers was benifit for improving the thermally conductive coefficient (λ) and decreasing dielectric constant (ε) values of the PPS nanocomposites. The f-nBN/PPS nanocomposite with 60 wt% f-BN fillers was an excellent dielectric nanocomposite with high λ & ideal ε values and outstanding thermal stability, λ of 1.122 W/m K (increased by 400% compared to that of pristine PPS matrix), ε of 3.99 and THeat-resistance index (THRI) beyond 275 °C, which holds potential for electronic packaging materials and ultra high voltage electrical apparatus.
KW - A. Polymer-matrix composites (PMCs)
KW - B. Thermal properties
KW - E. Compression moulding
UR - http://www.scopus.com/inward/record.url?scp=85021245206&partnerID=8YFLogxK
U2 - 10.1016/j.compositesa.2017.06.005
DO - 10.1016/j.compositesa.2017.06.005
M3 - 文章
AN - SCOPUS:85021245206
SN - 1359-835X
VL - 101
SP - 237
EP - 242
JO - Composites Part A: Applied Science and Manufacturing
JF - Composites Part A: Applied Science and Manufacturing
ER -