摘要
Ag-Cu alloy film was deposited by arc ion plating (AIP). Atomic oxygen (AO) irradiation experiments were conducted using a ground AO simulation facility. The structure, morphology, composition and tribological property of the Ag-Cu alloy film before and after AO irradiation were investigated and compared with Ag film using X-ray diffraction (XRD), field emission scanning electron microscope (FESEM), X-ray photoelectron spectroscope (XPS) and ball-on-disk tribometer, respectively. In depth XPS analysis clearly shows that the affected thickness of Ag-Cu alloy film was greatly reduced and the oxidation product was mainly Ag 2 O, but AgO and Ag 2 O in case of pure Ag film. As a result, the Ag-Cu alloy film exhibited better AO resistant behaviors, and showed a stable friction and low wear after the AO irradiation. The AO resistant behaviors of the Ag-Cu alloy film were discussed in terms of the film microstructure.
源语言 | 英语 |
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页(从-至) | 7643-7648 |
页数 | 6 |
期刊 | Applied Surface Science |
卷 | 257 |
期 | 17 |
DOI | |
出版状态 | 已出版 - 15 6月 2011 |
已对外发布 | 是 |