Hot press bonding of γ-TiAl and TC17 at a low bonding temperature by imposing plastic deformation and post heating

Hong Li, Chao Yang, Lixing Sun, Miaoquan Li

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25 引用 (Scopus)

摘要

The hot press bonding of γ-TiAl alloy and TC17 alloy was successfully conducted at a low bonding temperature of 850 °C by imposing plastic deformation of TC17 alloy and post heating at 840 °C for 60 min. The results indicate that the effect of plastic deformation and heating on the microstructure and microhardness of diffusion zone is very significant while this effect on base alloys can be ignored. The increasing plastic deformation of TC17 alloy and heating promote the shrinking of voids and the increasing of the width of diffusion zone because of the enhancing atom diffusion. A sound metallurgical bond with the microhardness in a narrow range of 314–345 HV is obtained by imposing a percentage of TC17 deformation of 50% and post heating.

源语言英语
页(从-至)4-6
页数3
期刊Materials Letters
187
DOI
出版状态已出版 - 15 1月 2017

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