TY - JOUR
T1 - Highly thermally conductive carbon nanotubes pillared exfoliated graphite/polyimide composites
AU - Guo, Yongqiang
AU - Wang, Shuangshuang
AU - Ruan, Kunpeng
AU - Zhang, Haitian
AU - Gu, Junwei
N1 - Publisher Copyright:
© 2021, The Author(s).
PY - 2021/12
Y1 - 2021/12
N2 - In this work, carbon nanotubes pillared grew on exfoliated graphite by the microwave-assisted method is utilized as thermally conductive fillers (CPEG) in polyimide (PI) to fabricate CPEG/PI thermally conductive composites with the combining ways of “in-situ polymerization, electrospinning, lay-up, and hot-pressing”. The prepared CPEG/PI composites realized the maximum thermal conductivity (λ, 1.92 W m−1 K−1) at low CPEG amount (10 wt%), much higher than that of pure PI (0.28 W m−1 K−1). The λ of CPEG/PI composites show almost no change after 1000 cycles of heating and cooling at the temperature of 25−100 °C. The finite element analysis simulates the nano-/microscale heat transfer in CPEG/PI composites to reveal the internal reason of the λ enhancement. The improved thermal conductivity model and empirical equation could better reflect the actual λ change trend of CPEG/PI composites. The actual application test shows the CPEG/PI composites could significantly reduce the operating temperature of the CPU in mobile phone.
AB - In this work, carbon nanotubes pillared grew on exfoliated graphite by the microwave-assisted method is utilized as thermally conductive fillers (CPEG) in polyimide (PI) to fabricate CPEG/PI thermally conductive composites with the combining ways of “in-situ polymerization, electrospinning, lay-up, and hot-pressing”. The prepared CPEG/PI composites realized the maximum thermal conductivity (λ, 1.92 W m−1 K−1) at low CPEG amount (10 wt%), much higher than that of pure PI (0.28 W m−1 K−1). The λ of CPEG/PI composites show almost no change after 1000 cycles of heating and cooling at the temperature of 25−100 °C. The finite element analysis simulates the nano-/microscale heat transfer in CPEG/PI composites to reveal the internal reason of the λ enhancement. The improved thermal conductivity model and empirical equation could better reflect the actual λ change trend of CPEG/PI composites. The actual application test shows the CPEG/PI composites could significantly reduce the operating temperature of the CPU in mobile phone.
UR - http://www.scopus.com/inward/record.url?scp=85110671835&partnerID=8YFLogxK
U2 - 10.1038/s41528-021-00113-z
DO - 10.1038/s41528-021-00113-z
M3 - 文章
AN - SCOPUS:85110671835
SN - 2397-4621
VL - 5
JO - npj Flexible Electronics
JF - npj Flexible Electronics
IS - 1
M1 - 16
ER -